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30 avr. 2026 05h39 HE | Source: SCHMID Group N.V.

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
10 nov. 2025 06h20 HE | Source: SCHMID Group N.V.

SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment

SCHMID Group wins major PLP & mSAP equipment orders in Asia, strengthening its role in advanced PCB & IC-substrate manufacturing amid surging AI demand.
22 oct. 2025 07h31 HE | Source: SCHMID Group N.V.

SCHMID Group secures Major Orders for AI Server PCB Production Equipment

SCHMID Group wins two major PCB orders for AI server applications, delivering full production lines with V+ and H+ systems to drive AI hardware growth.