ROHM’s New SerDes ICs for Automotive Multi-Displays Simplify Video Transmission
27 oct. 2022 17h00 HE
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ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, Oct. 27, 2022 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced new full-HD compatible (1980 x 1080 pixels) SerDes ICs (serializer: BU18TL82-M; deserializer:...
ROHM Partners with Nanjing SemiDrive Technology Ltd., China’s SoC Manufacturer of Next-Generation Cockpits, to Develop Automotive Solutions
06 sept. 2022 17h00 HE
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ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, Sept. 06, 2022 (GLOBE NEWSWIRE) -- Global semiconductor supplier ROHM, together with SemiDrive Technology, a leading automotive-grade chip vendor in China, today...
Broadcom Drives Ecosystem Transition with Industry-Leading PCIe Gen 5.0 Product Portfolio
24 févr. 2022 09h00 HE
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Broadcom Inc.
SAN JOSE, Calif., Feb. 24, 2022 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ:AVGO), the worldwide leader in PCIe, SerDes, and switching technology, today announced its broad, industry-leading PCIe Gen...
ALPHAWAVE IP RECEIVES PRESTIGIOUS 2021 TSMC OIP PARTNER OF THE YEAR AWARD FOR HIGH-SPEED SERDES IP
29 oct. 2021 07h05 HE
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Alphawave
Toronto, Ontario, Canada, and Hsinchu, Taiwan, Oct. 29, 2021 (GLOBE NEWSWIRE) -- Alphawave IP has been recognized by TSMC as a recipient of the 2021 OIP Partner of the Year award for High-Speed...
ROHM’s New SerDes ICs and PMIC Optimized for Automotive Satellite Camera Modules
15 sept. 2021 17h00 HE
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ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, Sept. 15, 2021 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced new SerDes ICs (BU18xMxx-C series*) and a Power Management IC (PMIC) (BD86852MUF-C) ideal for...
Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
08 sept. 2021 08h09 HE
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Microchip Technology Incorporated
CHANDLER, Ariz., Sept. 08, 2021 (GLOBE NEWSWIRE) -- Routers, switches and line cards need higher bandwidth, port density and up to 800 Gigabit Ethernet (GbE) connectivity to handle escalating data...
Kandou Raises $92.3 Million in Series C Funding
17 nov. 2020 11h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Nov. 17, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in...
SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications
30 oct. 2019 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) -- Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by SEAKR® Engineering...
Kandou Secures $56 Million in Series C Funding
23 sept. 2019 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Sept. 23, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in connectivity IP and chip solutions, today announced an additional investment of $56 million, through a consortium...
Kandou Announces Development of USB4™ Retimer
10 sept. 2019 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Sept. 10, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in ultra-low power wired connectivity, has announced development is underway for the industry’s first USB-C®...