Menlo Micro Through Glass Via (TGV) Package
Menlo Micro, Corning Demonstrate World’s First Through Glass Via (TGV) Package for MEMS Switch Applications
12 juin 2018 10h00 HE | Menlo Microsystems, Inc.
PHILADELPHIA, June 12, 2018 (GLOBE NEWSWIRE) -- A new era of high-performance RF and power switching products has begun. Corning Incorporated and Menlo Micro, the company responsible for...