Northrop Grumman Offers Connector-X(tm), Ultra High-Speed Compression Mount Interconnect

Falls Church, Virginia, UNITED STATES

WATERTOWN, Conn., Oct. 11, 2001 (PRIMEZONE) -- Northrop Grumman Corporation (NYSE:NOC) today announced Connector-X(tm), a new ultra high-speed compression mount interconnect with transmission rates up to 10Gb/s, developed by Winchester Electronics, a business unit of Northrop Grumman's Component Technologies sector. Connector-X(tm) is the latest high-speed, board-to-board interconnect system designed to shrink the size and increase the data rates of the next generation of telecommunications equipment.

Connector-X(tm) is the first true 10Gb/s interconnect system that extends the life of copper. This one-piece, compression mount connector system will allow the continued use of a copper interconnect path well beyond the 2.5Gb/s interconnect systems on the market today. The application of this interconnect system can be used to achieve 10Gb/s data rate transmission with less than 2 percent crosstalk at 50ps rise times on those high-end applications where speed and performance is essential. Additionally, this connector system can reduce the cost of existing systems requiring high-speed board materials to achieve 2.5Gb/s by converting back to standard FR-4 material.

Product availability for initial evaluation samples is four to six weeks ARO. Production quantities will be available in early 2002.

Winchester Electronics, a business unit of Northrop Grumman's Component Technologies sector, is a premier provider of high-speed, high-bandwidth interconnect products, including board-to-board connectors, RF connectors, cable assemblies, and power interconnects to the telecommunications, electronics and information technology industries. Winchester supports the specific needs of its customers globally with technical Centers of Excellence in Watertown, Calif., Mexico, China and Malaysia.

Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical, and military markets. Component Technologies includes Winchester Electronics, Interconnect Technologies, Kester, Life Support, Poly-Scientific, Precision Products International and VEAM.

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