SPRINGFIELD, Mo., Aug. 5, 2003 -- Northrop Grumman Corporation (NYSE:NOC) today announced that Interconnect Technologies, a business unit of the company's Component Technologies sector, has been granted supplier qualification by the Department of Defense's Defense Supply Center Columbus (DSCC) to the Military Specification MIL-PRF-55110F - Printed Wiring Board, Rigid, General Specification for Type 3, GI (Polyimide) material. The business was awarded qualification in April for Type 3, GF (Epoxy-FR4) material.
MIL-PRF-55110F is the specification used to procure and manufacture certain military or defense printed circuit board products. "This material qualification broadens our leading-edge product offerings used in the United States' defense and aerospace market," said Bill Moore, general manager of Interconnect Technologies North America Operations.
"This latest qualification further validates Interconnect Technologies' high level of quality and reliability standards," added Ron Walker, quality director for Interconnect Technologies. "This certification focuses on the defense and aerospace market, yet is applicable to other markets with equally demanding requirements."
DSCC, located in Columbus, Ohio, is the largest supplier of weapon systems spare parts and end items for the Department of Defense. Products must be manufactured in the United States to be certified and pass stringent laboratory analysis. Specific product characteristics are published by DSCC in its Quality Manufacturers List.
Interconnect Technologies manufactures complex, technology-driven, high-performance electronic and electro-optical printed circuit boards and backpanel assemblies through cabinet-level assembly to the world's leaders in the electronics industry. Headquartered in Springfield, Mo., it has operations in Scotland, California, China and Malaysia.
Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies includes Interconnect Technologies, Kester(r), Life Support, Poly-Scientific, Precision Products International and Winchester Electronics.
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