Contact Information: Company contact: Tony Trunzo FLIR Systems, Inc. (503) 498-3547 www.flir.com
AMI Semiconductor and FLIR Systems Announce Agreement
AMIS to Manufacture FLIR Microbolometers
| Source: FLIR Systems, Inc.
POCATELLO, ID and PORTLAND, OR -- (MARKET WIRE) -- October 16, 2006 -- AMI Semiconductor (NASDAQ : AMIS ), a designer and manufacturer of state-of-the-art integrated
mixed-signal and structured digital products, and FLIR Systems (NASDAQ : FLIR ), the world leader in commercial infrared technology, today announced
an agreement for high volume manufacturing of uncooled microbolometer
infrared detectors. Under the agreement, FLIR will install its proprietary
microbolometer detector process at AMI Semiconductor's Class 1, eight-inch
fabrication facility in Pocatello, Idaho. The agreement will expand
current microbolometer detector manufacturing capability and will also
provide an opportunity to improve sensor yield by installing the process in
a Class 1 fabrication facility.
"We are pleased to expand on our already successful partnership with AMIS,"
said Earl R. Lewis, President, CEO and Chairman of FLIR Systems. "AMIS has
supplied the CMOS read-out integrated circuit (ROIC) portion of our
detectors for several years. This relationship, coupled with AMI
Semiconductor's expertise in custom process installations and Class 1
fabrication, makes them the logical and obvious choice as our high volume
microbolometer manufacturing partner."
The implementation of FLIR's proprietary microbolometer production process
further demonstrates AMI Semiconductor's value as a foundry for complex
semiconductor components. The growth of thermal imaging equipment in both
the commercial and military markets requires the high volume, high yield
and low cost capabilities that the foundry model offers. AMI
Semiconductor's mixed-signal process, manufacturing expertise, and
extensive quality certifications make the company an excellent source for
FLIR's microbolometer arrays.
"This agreement deepens our existing partnership with FLIR Systems," said
Chris King, AMI Semiconductor CEO. "Thermal imaging is a fast growing
market in which FLIR and AMIS can develop and supply superior products. We
anticipate this relationship to be a longstanding one, benefiting both
companies along with FLIR's customers."
About FLIR Systems
FLIR Systems, Inc. is a world leader in the design, manufacture and
marketing of thermal imaging and stabilized camera systems for a wide
variety of thermography and imaging applications including condition
monitoring, research and development, manufacturing process control,
airborne observation and broadcast, search and rescue, drug interdiction,
surveillance and reconnaissance, navigation safety, border and maritime
patrol, environmental monitoring and ground-based security. Visit the
company's web site at www.FLIR.com.
About AMI Semiconductor
AMI Semiconductor (AMIS) is a leader in the design and manufacture of
silicon solutions for the real world. As a widely recognized innovator in
state-of-the-art integrated mixed-signal and structured digital products,
AMIS is committed to providing customers with the optimal value, quickest
time-to-market semiconductor solutions. Offering unparalleled manufacturing
flexibility and dedication to customer service, AMI Semiconductor operates
globally with headquarters in Pocatello, Idaho, European corporate offices
in Oudenaarde, Belgium, and a network of sales and design centers located
in the key markets of the North America, Europe and the Asia Pacific
region.
Forward-Looking Statements
The statements in this press release, including the quotes by Earl Lewis
and Chris King, are forward-looking statements within the meaning of the
Private Securities Litigation Reform act of 1995. These statements are
based on current expectations, estimates and projections about the
Company's business based, in part, on assumptions made by management.
These statements are not guarantees of future performance and involve risks
and uncertainties that are difficult to predict. Therefore, actual
outcomes and results may differ materially from what is expressed or
forecasted in such forward-looking statements due to numerous factors,
including the ability of both companies to fulfill their respective
obligations under the agreement discussed above, the continuing ability to
penetrate new market applications for thermal imaging products, changes in
the competitive environment, changes in demand for the Company's products
generally, product mix, the timing of customer orders and deliveries, the
impact of competitive products and pricing, the Company's continuing
compliance with US export control laws and regulations, the timely receipt
of export licenses for international shipments, constraints on supplies of
critical components, actual purchases under existing agreements, the
continuing eligibility of the Company to act as a federal contractor, the
amount and availability of appropriated government procurement funds as
well as other risk factors discussed from time to time in the Company's
Securities and Exchange Commission filings and reports, including the
Company's Annual Report on Form 10-K for the year ended December 31, 2005.
In addition, such statements could be affected by general industry and
market conditions and growth rates, and general domestic and international
economic conditions. Such forward-looking statements speak only as of the
date on which they are made and the company does not undertake any
obligation to update such statements after the date of this release.