Contact Information: Contact: Arthur Sainio SMART Modular Technologies, Inc. (510) 624-8126 Email Contact
SMART Modular Technologies Expands Its FBDIMM Validation and Interoperability Testing Services
Cost Reduction Qualification Service for OEMs; Testing Interoperability Across Multiple DRAM, AMB, and System Combinations; Thorough Diagnostic, Signal Integrity, and Four Corner Testing Performed
| Source: SMART Modular Technologies
FREMONT, CA -- (MARKET WIRE) -- April 16, 2007 -- SMART Modular Technologies (WWH), Inc. (SMART)
(NASDAQ : SMOD ), a leading independent manufacturer of memory modules,
embedded computing subsystems, and TFT-LCD display products, has expanded
its high performance computing (HPC) lab to support fully buffered DIMM
(FBDIMM) validation and interoperability testing services for OEMs and
advanced memory buffer (AMB) suppliers. These services enable OEMs to
reduce their qualification costs and cycle time by outsourcing otherwise
extensive in-house testing.
SMART has made significant investments to expand its HPC lab to perform
FBDIMM validation and interoperability testing equivalent to what top tier
OEMs require. SMART is currently performing this service for a major OEM
and AMB supplier. The scope of the process includes interoperability
testing with over 33 different FBDIMM combinations using six DRAM suppliers
and two AMB versions. Extensive signal integrity, diagnostic and four
corner testing are performed and a comprehensive qualification report is
provided with each FBDIMM set.
With a long track record conducting validation programs, SMART began by
validating PC100 memory for Intel®. Follow-on validation programs
included PC133 for Intel and DDR for AMD™, VIA™, and NVIDIA®.
Launching new technologies on new platforms is never an easy process;
however, SMART's accumulated knowledge and experience is a value-add for
aiding OEM system designers in steering clear of obstacles. With maturing
technologies, it's becoming more cost-effective for OEMs to outsource
sustaining qualifications to their industry partners.
"SMART is pleased that its expanded HPC lab offers FBDIMM validation
services to OEMs and AMB suppliers," said Mike Rubino, SMART's Vice
President of Engineering. "The services we provide give OEMs the confidence
to know that ongoing DRAM and AMB die revisions as well as new AMB
suppliers can be thoroughly tested to assure smooth, continual product
lifecycle support."
About SMART
SMART is a leading independent designer, manufacturer and supplier of
electronic subsystems to original equipment manufacturers, or OEMs. SMART
offers more than 500 standard and custom products to OEMs engaged in the
computer, industrial, networking, gaming, telecommunications, and embedded
application markets. Taking innovations from the design stage through
manufacturing and delivery, SMART has developed a comprehensive memory
product line that includes DRAM, SRAM, and Flash memory in various form
factors. Its Embedded Products Division develops embedded computing
subsystems, backed by design and manufacturing, for markets supporting test
equipment, 3G infrastructure and network processing applications. SMART's
Display Products Group designs, manufactures and sells thin film
transistors (TFT) liquid crystal display (LCD) solutions to customers
developing casino gaming systems as well as embedded applications such as
kiosk, ATM, point-of-service, and industrial control systems. SMART's
presence in the US, Europe, Asia, and Latin America enables it to provide
its customers with proven expertise in international logistics, asset
management, and supply-chain management worldwide. See www.smartm.com for
more information.
Intel is a registered trademark of Intel Corporation.
AMD is a trademark of Advanced Micro Devices, Inc.
VIA is a trademark of VIA Technologies.
NVIDIA is a registered trademark of NVIDIA Corporation.