Contact Information: Media Contacts: Cain Communications for Sidense Jim Lipman Tel: 925-606-1370 Email:
Sidense Qualifies 1T-Fuse(TM) in UMC's 130nm Process
Embedded Non-Volatile Memory IP Ideal for Low-Cost, Secure Applications
| Source: Sidense
TORONTO and OTTAWA, ON--(Marketwire - June 11, 2007) - Sidense, a leading developer of
Logic Non-Volatile Memory (NVM) IP cores, today announced it has qualified
its logic non-volatile memory (NVM) intellectual property (IP) in UMC's
130nm standard logic CMOS process. By qualifying the NVM IP, a valuable
memory addition to the foundry's IP Alliance Program, UMC's customers now
have access to a low-cost, highly secure embedded NVM for applications such
as electrical fuse replacement, flash and mask-programmable ROM
replacement, code storage, RFID, unique ID, encryption, key storage, HDMI,
and digital rights management (DRM).
"By qualifying our IP in UMC's 130nm standard logic CMOS process, we have
taken another step in providing our customers with low-cost, embedded,
non-volatile memory IP for their mainstream chips," said Xerxes Wania,
President and CEO of Sidense. "Our 1T-Fuse™ based Logic NVM cores are
among the fastest, most secure and smallest available, giving chip
designers the ability to put inexpensive field-programmable storage on
their chips for a variety of low and high bit-count applications."
"We are delighted to add Sidense's memory offerings to UMC's IP Alliance
Program. Sidense's embedded memory gives our customers an excellent
embedded storage capability for their chips, available on a fully qualified
UMC process," said Ken Liou, director of the IP and Design Support division
at UMC. "As SoC storage requirements continue to rise, secure embedded NVM
will become increasingly important for many applications, such as those in
the consumer and automotive markets."
About 1T-Fuse
Sidense's 1T-Fuse Logic NVM IP is based on a one-time programmable (OTP)
technology that is one of the smallest and fastest in the industry. It
requires no additional mask layers or process steps and is portable across
several different technology nodes and foundries. Furthermore, the OTP can
be programmed in the field, during wafer or production testing. Sidense's
products are targeted to standard logic digital CMOS processes that are
180nm, 130nm, 90nm, 65nm and smaller at several well-known foundries. Ideal
applications include electrical fuse replacement, flash and
mask-programmable ROM replacement, code storage, RFID, unique ID,
encryption, key storage, HDMI and digital rights management (DRM).
About Sidense
Sidense provides secure, dense and reliable non-volatile one-time
programmable (OTP) memory IP cores for use in standard-logic CMOS
processes, with no additional masks or process steps required. The memory
is portable across several different technology nodes and foundries, and
can be programmed in the field or during wafer or production testing. The
company has offices in Mississauga and Ottawa, Canada and sales offices in
San Francisco, CA and Tokyo, Japan. For more information, visit
www.sidense.com.
About UMC
UMC (NYSE : UMC ) (TSE : 2303 ) is a leading global semiconductor foundry that
manufactures advanced system-on-chip (SoC) designs for applications
spanning every major sector of the IC industry. UMC's SoC Solution Foundry
strategy is based on the strength of the company's advanced technologies,
which include production proven 90nm, 65nm, mixed signal/RFCMOS, and a wide
range of specialty technologies. Production is supported through 10 wafer
manufacturing facilities that include two advanced 300mm fabs; Fab 12A in
Taiwan and Singapore-based Fab 12i are both in volume production for a
variety of customer products. The company employs approximately 12,000
people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and
the United States. UMC can be found on the web at http://www.umc.com.