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STATS ChipPAC Celebrates Expansion in China With Grand Opening of Second Manufacturing Facility
| Source: STATS ChipPAC
UNITED STATES--(Marketwire - October 23, 2007) - SINGAPORE - 10/23/2007 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (NASDAQ : STTS ) (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, today announced the grand opening of a second 371,000 square foot
manufacturing facility in Shanghai, China.
The new facility almost doubles the Company's current floor space of
422,000 square feet, further strengthening STATS ChipPAC's position as the
largest full turnkey assembly and test service provider in China. STATS
ChipPAC Shanghai offers high volume, low cost turnkey solutions including
wafer probe, assembly, final test and distribution to support multiple
customers in markets such as PC chipsets, computing, consumer and broadband
applications.
"China is a growing market and an important strategic location for our
customers and our Company. STATS ChipPAC has differentiated itself by the
depth of our technology portfolio in China, proven high volume
manufacturing experience and a successful business model based on full
turnkey solutions," said Wan Choong Hoe, Executive Vice President and Chief
Operating Officer, STATS ChipPAC.
In addition to the recent floor space expansion, STATS ChipPAC has been
rapidly building its technology portfolio in China with advanced die attach
and wire bond processes, advanced mold processes, film die attach and wafer
thinning. With high volume production experience in Plastic Ball Grid
Array (PBGA) packages, three dimensional (3D) stacking and
System-in-Package (SiP) solutions, STATS ChipPAC Shanghai is one of the
most advanced integrated circuit (IC) subcontractors in China. STATS
ChipPAC is also adding a turnkey flip chip solution from bump, sort and
assembly to final test in China.
"Today we celebrate the significant milestones and success that STATS
ChipPAC Shanghai has achieved over the past 12 years and the potential for
growth we believe is ahead. From research and development to design,
assembly, and test, we have the resources, equipment, and advanced
processes necessary to ensure our customers have a competitive edge in
their markets," said Lee Yik Choong, President and Managing Director, STATS
ChipPAC Shanghai.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ : STTS )
(SGX-ST: STATSChP) is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions. A trusted partner and
supplier to leading semiconductor companies worldwide, STATS ChipPAC
provides fully integrated, multi-site, end-to-end packaging and testing
solutions that bring products to the market faster. Our customers are some
of the largest wafer foundries, integrated device manufacturers (IDMs) and
fabless companies in the United States, Europe and Asia. STATS ChipPAC is a
leader in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, digital consumer and computing. With advanced process
technology capabilities and a global manufacturing presence spanning
Singapore, South Korea, China, Malaysia, Thailand and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Colorado and North Carolina). Our offices outside the United States are
located in South Korea, Singapore, China, Malaysia, Thailand, Taiwan,
Japan, the Netherlands and United Kingdom. STATS ChipPAC's facilities
include those of its subsidiary, STATS ChipPAC Taiwan Semiconductor
Corporation (formerly known as Winstek Semiconductor Corporation), in
Hsinchu District, Taiwan. These facilities offer new product introduction
support, pre-production wafer sort, final test, packaging and other high
volume preparatory services. Together with our research and development
centers in South Korea, Singapore, Malaysia, China, Taiwan and the United
States as well as test facilities in the United States, this forms a global
network providing dedicated test engineering development and product
engineering support for customers from design to volume production. STATS
ChipPAC is listed on both the Nasdaq Stock Market (NASDAQ) and the
Singapore Exchange Securities Trading Limited (SGX-ST). In addition, STATS
ChipPAC is also included in the Morgan Stanley Capital International
(MSCI) Index. Further information is available at www.statschippac.com.
Information contained in this website does not constitute a part of this
release.
Certain statements in this release, including statements regarding expected
future financial results and industry growth, are forward-looking
statements that involve a number of risks and uncertainties that could
cause actual events or results to differ materially from those described in
this release. Factors that could cause actual results to differ from our
expectations include, but are not limited to, general business and economic
conditions and the state of the semiconductor industry; level of
competition; demand for end-use applications products such as
communications equipment and personal computers; decisions by customers to
discontinue outsourcing of test and packaging services; reliance on a small
group of principal customers; continued success in technological
innovations; availability of financing; pricing pressures including
declines in average selling prices; ability to meet specific conditions
imposed for the continued trading or listing of the Company's securities on
the SGX-ST and the NASDAQ; our substantial level of indebtedness; potential
impairment charges; adverse tax and other financial consequences if the
South Korean taxing authorities do not agree with our interpretation of the
applicable tax laws; ability to develop and protect our intellectual
property; rescheduling or canceling of customer orders; changes in products
mix; intellectual property rights disputes and litigation; capacity
utilization; delays in acquiring or installing new equipment; limitations
imposed by our financing arrangements which may limit our ability to
maintain and grow our business; changes in customer order patterns;
shortages in supply of key components; disruption of our operations; loss
of key management or other personnel; defects or malfunctions in our
testing equipment or packages; changes in environmental laws and
regulations; exchange rate fluctuations; regulatory approvals for further
investments in our subsidiaries; significant ownership by Temasek Holdings
that may result in conflicting interests with Temasek Holdings and our
affiliates; unsuccessful acquisitions and investments in other companies
and businesses; our ability to continue to successfully integrate the
operations of the former separate STATS and ChipPAC companies and their
employees; labor union problems in South Korea; uncertainties of conducting
business in China; natural calamities and disasters, including outbreaks of
epidemics and communicable diseases; and other risks described from time to
time in the Company's SEC filings, including its annual report on Form 20-F
dated March 12, 2007. We undertake no obligation to publicly update or
revise any forward-looking statements, whether as a result of new
information, future events or otherwise.