FREMONT, CA--(Marketwire - November 13, 2007) - SMART Modular Technologies (WWH), Inc. (SMART) (NASDAQ: SMOD), a leading independent manufacturer of memory modules, embedded computing subsystems, and TFT-LCD display products, has added to its lineup of Socket F, DDR2 registered error checking and correcting (ECC) DIMMs with its new 8GB module. The new RoHS-compliant module incorporates SMART's dual die packaging (DDP) technology and provides cost advantages by leveraging mainstream 1Gb DDR2-667 and DDR2-800 technology.

SMART's latest high-density memory solution is well suited for use in high-performance computing (HPC) applications and large data center deployments. HPC implementations are spreading rapidly from R&D and academic environments to commercial businesses and enterprises that need to process compute-intensive workloads. To provide optimal performance in these environments, the new registered DIMMs (RDIMMs) can be used in systems equipped with advanced ECC, such as Chipkill™ technology by IBM Corporation (NYSE: IBM). In addition, SMART's 8GB RDIMMs are fully compatible with four-rank enabled Socket F systems.

The DDP-based 8GB DDR2-667 RDIMM looks and performs like a standard dual-row four-rank module, however, SMART's unique DDP technology actually doubles the density. As a result of the identical footprint, the DDP-based RDIMM offers OEMs a transparent upgrade path from standard modules. The 8GB DDR2-667 RDIMM is configured as 1024Mx72 with four-ranks using 2Gb (512Mx4) DDP components.

"SMART's lineup of 8GB modules provides one of the industry's broadest product portfolios to address demand for robust, cost-effective high-density solutions in HPC applications," said Gene Patino of SMART's worldwide HPC business unit.

SMART's new 8GB DDR2 RDIMM offers OEMs the lowest cost options to upgrade their systems with more memory. The new 8GB DDR2-667 version enables OEMs to populate 4-way, 8-socket, dual-rank and quad-rank enabled systems with up to 256GB of memory per node running at a 667MHz data rate.

SMART supports the complete design, assembly, and test process from raw wafers to finished modules. Its extensive on-site, independently-audited HPC lab provides the systems and resources to extensively evaluate new products prior to launch.

For more information and part numbers visit


SMART is a leading independent designer, manufacturer and supplier of electronic subsystems to original equipment manufacturers, or OEMs. SMART offers more than 500 standard and custom products to OEMs engaged in the computer, industrial, networking, gaming, telecommunications, and embedded application markets. Taking innovations from the design stage through manufacturing and delivery, SMART has developed a comprehensive memory product line that includes DRAM, SRAM, and Flash memory in various form factors. Its Embedded Products Division develops embedded computing subsystems, backed by design and manufacturing, for markets supporting test equipment, 3G infrastructure and network processing applications. SMART's Display Products Group designs, manufactures and sells thin film transistors (TFT) liquid crystal display (LCD) solutions to customers developing casino gaming systems as well as embedded applications such as kiosk, ATM, point-of-service, and industrial control systems. SMART's presence in the US, Europe, Asia, and Latin America enables it to provide its customers with proven expertise in international logistics, asset management, and supply-chain management worldwide. See for more information.

Forward-Looking Statements

Statements contained in this press release, that are not statements of historical fact, including any statements that use the words "will," "believes," "anticipates," "estimates," "expects," "intends" or similar words that describe the company's or its management's future plans, objectives, or goals, are "forward-looking statements" and are made pursuant to the safe-harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements may include the company's financial performance, technical capabilities, business strategies and product plans as well as potential market demand for its products.

Such forward-looking statements involve known and unknown risks, uncertainties and other factors that could cause the actual results of the company to be materially different from the historical results and/or from any future results or outcomes expressed or implied by such forward-looking statements. Factors that would cause or contribute to such differences include, but are not limited to, production or manufacturing difficulties, competitive factors, new products and technological changes, fluctuations in product prices and raw material costs, dependence upon third-party vendors, customer or market demand or acceptance of our new products, changes in industry standards or release plans, and other risks detailed in the company's periodic report filings with the Securities and Exchange Commission. Such risk factors as outlined in these reports may not constitute all factors that could cause actual results to differ materially from those discussed in any forward-looking statement. The company operates in a continually changing business environment and new factors emerge from time to time. The company cannot predict such factors, nor can it assess the impact, if any, from such factors on the company or its results. Accordingly, forward-looking statements should not be relied upon as a prediction of actual results. The company is not obligated to revise or update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this press release.

Chipkill is a trademark of the IBM Corporation.

Contact Information: Contact: Joy Donohue SMART Modular Technologies (978) 805-2164