SMART Modular Technologies Expands DDR2 Registered DIMM Family With New 8GB Option
New 8GB Registered DIMMs Manufactured Using SMART's Dual Die Packaging Technology for High-Performance Computing and Server Applications
FREMONT, CA--(Marketwire - November 13, 2007) - SMART Modular Technologies (WWH), Inc. (SMART)
(NASDAQ: SMOD), a leading independent manufacturer of memory modules,
embedded computing subsystems, and TFT-LCD display products, has added to
its lineup of Socket F, DDR2 registered error checking and correcting
(ECC) DIMMs with its new 8GB module. The new RoHS-compliant module
incorporates SMART's dual die packaging (DDP) technology and provides cost
advantages by leveraging mainstream 1Gb DDR2-667 and DDR2-800 technology.
SMART's latest
high-density memory solution is well suited for use in high-performance
computing (HPC) applications and large data center deployments. HPC
implementations are spreading rapidly from R&D and academic environments to
commercial businesses and enterprises that need to process
compute-intensive workloads. To provide optimal performance in these
environments, the new registered DIMMs (RDIMMs) can be used in systems
equipped with advanced ECC, such as Chipkill™ technology by IBM
Corporation (NYSE: IBM). In addition, SMART's 8GB RDIMMs are fully
compatible with four-rank enabled Socket F systems.
The DDP-based 8GB DDR2-667 RDIMM looks and performs like a standard
dual-row four-rank module, however, SMART's unique DDP technology actually
doubles the density. As a result of the identical footprint, the DDP-based
RDIMM offers OEMs a transparent upgrade path from standard modules. The 8GB
DDR2-667 RDIMM is configured as 1024Mx72 with four-ranks using 2Gb (512Mx4)
DDP components.
"SMART's lineup of 8GB modules provides one of the industry's broadest
product portfolios to address demand for robust, cost-effective
high-density solutions in HPC applications," said Gene Patino of SMART's
worldwide HPC business unit.
SMART's new 8GB DDR2 RDIMM offers OEMs the lowest cost options to upgrade
their systems with more memory. The new 8GB DDR2-667 version enables OEMs
to populate 4-way, 8-socket, dual-rank and quad-rank enabled systems with
up to 256GB of memory per node running at a 667MHz data rate.
SMART supports the complete design, assembly, and test process from raw
wafers to finished modules. Its extensive on-site, independently-audited
HPC lab provides the systems and resources to extensively evaluate new
products prior to launch.
For more information and part numbers visit www.smartm.com/channel/hpc.
About SMART
SMART is a leading independent designer, manufacturer and supplier of
electronic subsystems to original equipment manufacturers, or OEMs. SMART
offers more than 500 standard and custom products to OEMs engaged in the
computer, industrial, networking, gaming, telecommunications, and embedded
application markets. Taking innovations from the design stage through
manufacturing and delivery, SMART has developed a comprehensive memory
product line that includes DRAM, SRAM, and Flash memory in various form
factors. Its Embedded Products Division develops embedded computing
subsystems, backed by design and manufacturing, for markets supporting test
equipment, 3G infrastructure and network processing applications. SMART's
Display Products Group designs, manufactures and sells thin film
transistors (TFT) liquid crystal display (LCD) solutions to customers
developing casino gaming systems as well as embedded applications such as
kiosk, ATM, point-of-service, and industrial control systems. SMART's
presence in the US, Europe, Asia, and Latin America enables it to provide
its customers with proven expertise in international logistics, asset
management, and supply-chain management worldwide.
See www.smartm.com for more information.
Forward-Looking Statements
Statements contained in this press release, that are not statements of
historical fact, including any statements that use the words "will,"
"believes," "anticipates," "estimates," "expects," "intends" or similar
words that describe the company's or its management's future plans,
objectives, or goals, are "forward-looking statements" and are made
pursuant to the safe-harbor provisions of the Private Securities Litigation
Reform Act of 1995. These forward-looking statements may include the
company's financial performance, technical capabilities, business
strategies and product plans as well as potential market demand for its
products.
Such forward-looking statements involve known and unknown risks,
uncertainties and other factors that could cause the actual results of the
company to be materially different from the historical results and/or from
any future results or outcomes expressed or implied by such forward-looking
statements. Factors that would cause or contribute to such differences
include, but are not limited to, production or manufacturing difficulties,
competitive factors, new products and technological changes, fluctuations
in product prices and raw material costs, dependence upon third-party
vendors, customer or market demand or acceptance of our new products,
changes in industry standards or release plans, and other risks detailed in
the company's periodic report filings with the Securities and Exchange
Commission. Such risk factors as outlined in these reports may not
constitute all factors that could cause actual results to differ materially
from those discussed in any forward-looking statement. The company operates
in a continually changing business environment and new factors emerge from
time to time. The company cannot predict such factors, nor can it assess
the impact, if any, from such factors on the company or its results.
Accordingly, forward-looking statements should not be relied upon as a
prediction of actual results. The company is not obligated to revise or
update any forward-looking statements in order to reflect events or
circumstances that may arise after the date of this press release.
Chipkill is a trademark of the IBM Corporation.
Contact Information: Contact:
Joy Donohue
SMART Modular Technologies
(978) 805-2164