IRVINE, Calif., Jan. 15, 2008 (PRIME NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, has announced a new line of 38 standard power modules in the very low profile and compact SP1 package. Main applications are in power factor correction, motor control, UPS, power supplies, solar inverters and welding converters.
The new line's 12mm profile provides minimum parasitic inductance, while solderable pins provide easy mounting to top-printed circuit boards. The modules integrate a base plate which allows the use of thinner DBC substrates. The result is excellent heat spreading and low thermal resistance, with full electrical isolation to the heatsink.
The new compact power modules fill the size gap between SOT227 and SP3 products by offering the equivalent of two SOT227 packages in a single SP1 device. SP3 modules integrate the equivalent of four SOT227's.
"The low mechanical profile and internal layout of the SP1 package results in very low parasitics, allowing the end user to get outstanding performance from ultrafast semiconductor devices," said Serge Bontemps, Power Modules Products Development Director in Merignac, France. "With a choice of 38 modules in our new SP1 line, there are excellent options wherever space, electrical and thermal performance, weight and cost are a concern," he said.
The new Microsemi modules line includes phase leg, full bridge, buck and boost configurations. Emitter/Source switches on the bottom of the full bridge modules provide separate connections for possible use of current sensors. All the new modules integrate a thermal sensor to monitor case temperature and provide over-temperature protection.
The four module configurations provide a variety of transistor options: FREDFET switches for the phase legs and full bridge modules; standard MOSFETs for buck and boost devices, plus CoolMos(tm), NPT, and TRENCH IGBTs.
All the SP1 MOSFET and FREDFET standard modules use the latest MOS8(tm) Power MOSFET from Microsemi's Power Products Group. Current ratings range from 11A to 70A @ Tc= 80 Deg. C for voltages in the range of 500V to 1200V for MOSFET, FREDFET and CoolMOS modules. Current ratings range from 20A to 150A @ Tc= 80 Deg. C for voltages in the range of 600V to 1700V for NPT and TRENCH IGBT modules.
While the SP1 line is designed as standard modules for industrial applications, they are easily upgraded to withstand more demanding environmental conditions:
-- Aluminum Nitride substrate can replace standard alumina for
improved thermal performance
-- SiC diodes can replace FREDs for improved switching losses or
increased operating frequency
-- Aluminum Silicon Carbide (AlSiC) base plate can replace the
standard copper base plate for reduced weight and extended lifetime
against temperature cycles of wide amplitude
Samples are available immediately, with the lead time for 10K quantities at 8 to 12 weeks. Pricing in quantities of 1000 to 2500 pieces range from $13.60 to $48.17.
Complete specifications and technical data for the entire new SP1 power modules line are available on the Microsemi web site: www.microsemi.com.
About Microsemi Corporation
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.
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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements, including without limitation statements concerning the expectation and timing of the completion of the acquisition of MDT, the benefits of the acquisition of MDT and its products, Microsemi's ability to successfully integrate and leverage the acquired company and realize synergies, the possibility of efficiency gains, and Microsemi's ability to enter into the sensor market and expand its portfolio of microwave semiconductors. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. The potential risks and uncertainties include, but are not limited to, such factors as changes in generally accepted accounting principles, the difficulties regarding the making of estimates and projections, the hiring and retention of qualified personnel in a competitive labor market, acquiring, managing and integrating new operations, businesses or assets, uncertainty as to the future profitability of acquired businesses, delays in the realization of any accretion from acquisition transactions, any circumstances that adversely impact the end markets of acquired businesses, difficulties in closing or disposing of operations or assets, difficulties in transferring work from one plant to another, rapidly changing technology and product obsolescence, difficulties predicting the timing and amount of plant closure costs, the potential inability to realize cost savings or productivity gains and to improve capacity utilization, potential cost increases, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets including the challenging conditions in our analog / mixed-signal markets, results of in-process or planned development or marketing and promotional campaigns, changes in demand for products, difficulties foreseeing future demand, effects of limited visibility of future sales, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, business disruptions, epidemics, health advisories, disasters, national emergencies, wars or potential future effects of the tragic events of September 11, 2001, variations in customer order preferences, fluctuations in market prices of the company's common stock and potential unavailability of additional capital on favorable terms, difficulties in implementing company strategies, dealing with environmental or other regulatory matters or litigation, or any matters involving litigation, contingent liabilities or other claims, difficulties and costs imposed by law, including under the Sarbanes-Oxley Act of 2002, difficulties in determining the scope of, and procuring and maintaining, adequate insurance coverage, difficulties, and costs, of protecting patents and other proprietary rights, work stoppages, labor issues, inventory obsolescence and difficulties regarding customer qualification of products, manufacturing facilities and processes, and other difficulties managing consolidation or growth, including in the maintenance of internal controls, the implementation of information systems, and the training of personnel. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K filed by Microsemi with the SEC. Additional risk factors shall be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
Investor Inquiries: David R. Sonksen, Microsemi Corporation, Irvine, CA (949) 221-7101.