Microsemi Expands New Line of Ultra Compact SP1 Power Modules With Addition of Diode Bridge Modules


IRVINE, Calif., March 13, 2008 (PRIME NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC) a leading manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, has expanded its new line of ultra compact SP1 standard power modules with three standard rectifier 3-phase bridges and six high frequency FRED diode full bridges.

The three new Microsemi SP1 standard rectifier 3-phase bridge modules feature 1600V breakdown voltage with average currents of 40A, 70A and 90A.

The six modules with fast recovery diodes in full bridge configuration are available in 600V and 1200V versions, and with current ratings of 30A, 60A and 100A. Other voltages are possible upon demand. The fast diodes are from the latest DQ generation from Microsemi Power Products Group. Other fast diode technologies can be provided, such as 200V Schottky or SiC diodes.

"The introduction of these nine new ultra compact power modules shows our commitment to support the design of power systems with high performance and cost competitive products," said Russell Crecraft, General Manager, Power Products Group in Bend, Oregon. "With these standard rectifier 3-phase bridges and the high frequency diode bridges -- combined with our recently announced line of MOSFET and IGBT SP1 standard modules -- it is possible to achieve any power system up to 10 kW from our SP1 building blocks. Our new SP1 portfolio provides customers with a very high level of design flexibility," he said.

The new 3-phase and full bridges:


 Configuration     TYPE      BVCES      IF (A) @   VF (V)     Part
                              (V)       TC=80                Number
                                       Degrees C
 3 Phase bridge   Standard                 40       1,3  APTDR40X1601G
                  Rectifier  1600          70       1,3  APTDR70X1601G
                  diode                    90       1,3  APTDR90X1601G
 Full bridge      FRED                     30       1,8   APTDF30H601G
                  diode       600          60       1,8   APTDF60H601G
                                          100       1,6  APTDF100H601G
 Full bridge      FRED                     30       2,6  APTDF30H1201G
                  diode      1200          60       2,5  APTDF60H1201G
                                          100       2,5 APTDF100H1201G

Technical data sheets are available on the Microsemi website: www.microsemi.com. Samples are available immediately. Prices range from $14.54 to $20.49 in quantities of 1K to 5K.

About Microsemi Corporation

Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance, reliability and battery optimization, reducing size or protecting circuits. The principal markets the company serves include implantable medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its web site at http://www.microsemi.com.

The Microsemi Corporation logo is available at http://www.primenewswire.com/newsroom/prs/?pkgid=1233

PLEASE READ THE FOLLOWING FACTORS THAT CAN MATERIALLY AFFECT MICROSEMI'S FUTURE RESULTS.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements, including without limitation statements concerning our expectations regarding our business outlook, our performance and competitive position during the coming year, visibility into our customer demand, and any other statements of belief or about our plans or expectations. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as changes in generally accepted accounting principles, the difficulties regarding the making of estimates and projections, the hiring and retention of qualified personnel in a competitive labor market, acquiring, managing and integrating new operations, businesses or assets, uncertainty as to the future profitability of acquired businesses, delays in the realization of any accretion from acquisition transactions, any circumstances that adversely impact the end markets of acquired businesses, difficulties in closing or disposing of operations or assets, difficulties in transferring work from one plant to another, rapidly changing technology and product obsolescence, difficulties predicting the timing and amount of plant closure costs, the potential inability to realize cost savings or productivity gains and to improve capacity utilization, potential cost increases, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, changes in demand for products, difficulties foreseeing future demand, effects of limited visibility of future sales, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, business disruptions, epidemics, health advisories, disasters, national emergencies, wars or potential future effects of the tragic events of September 11, 2001, political instability, currency fluctuations, variations in customer order preferences, fluctuations in market prices of the company's common stock and potential unavailability of additional capital on favorable terms, difficulties in implementing company strategies, dealing with environmental or other regulatory matters or litigation, or any matters involving litigation, contingent liabilities or other claims, difficulties and costs imposed by law, including under the Sarbanes-Oxley Act of 2002, difficulties in determining the scope of, and procuring and maintaining, adequate insurance coverage, difficulties and costs of protecting patents and other proprietary rights, work stoppages, labor issues, inventory obsolescence and difficulties regarding customer qualification of products, manufacturing facilities and processes, and other difficulties managing consolidation or growth, including in the maintenance of internal controls, the implementation of information systems, and the training of personnel. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

Investor Inquiries: David R. Sonksen, Microsemi Corporation, Irvine, CA (949) 221-7101.



            

Contact Data