UNITED STATES--(Marketwire - March 18, 2008) - SINGAPORE -- 03/19/2008 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced a new IPD Products Databook which contains a library of silicon-based Integrated Passive Device (IPD) designs to assist semiconductor companies in reducing design cycle time and increasing integration options in Radio Frequency (RF) applications.

With the growing industry trend for increased integration in a smaller form factor, passive devices such as filters, diplexers, baluns and matching networks are being placed in packages alongside active semiconductor integrated circuits (ICs). As wireless systems have become smaller, there has been an increasing need to shrink passive devices, especially in terms of height. Design specifications, however, often compromise performance to achieve the desired level of miniaturization.

By integrating and fabricating passive devices at the silicon wafer level, STATS ChipPAC is able to produce IPDs in both wire bond and flip chip format which are significantly smaller, thinner and higher performing than standard discrete passive devices that are commercially available. Silicon-based IPDs enable semiconductor companies to effectively reduce device footprint and reduce interconnect complexity, while improving component tolerance, yield and reliability in RF applications such as GSM/DCS and CDMA cellular phones, Wireless LAN 802.11 a/b/g and WiMax systems.

The complexity of designing RF circuits typically translates into multiple design iterations and longer evaluation cycles. This is a factor that affects the speed at which semiconductor companies are able to bring their products to market. STATS ChipPAC has taken the next step in complex RF integration designs by offering semiconductor companies a tool to reduce cycle time and increase the flexibility of their RF module designs. The new IPD Products Databook contains technical information such as size, layout, component values and basic tolerances for complete IPD structures in a wide range of products.

"We have shipped over 40 million units of silicon-based passive devices in various configurations. We have correlated design and measured data to achieve a high rate of confidence in our RF component designs with first run silicon. Customization of IPDs for our customers' complex RF module designs can be rapidly deployed from the standard design configurations in the databook to achieve a lower overall cost and faster time-to-market," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

Forward-looking Statements

Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; level of competition; demand for end-use applications products such as communications equipment and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; availability of financing; prevailing market conditions; our ability to meet the applicable requirements for the termination of registration under the Exchange Act; our ability to meet specific conditions imposed for the continued listing or delisting of our ordinary shares on the SGX-ST; our substantial level of indebtedness; potential impairment charges; delays in acquiring or installing new equipment; adverse tax and other financial consequences if the South Korean taxing authorities do not agree with our interpretation of the applicable tax laws; our ability to develop and protect our intellectual property; rescheduling or canceling of customer orders; changes in our product mix; intellectual property rights disputes and litigation; our capacity utilization; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; changes in customer order patterns; shortages in supply of key components; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labor union problems in South Korea; uncertainties of conducting business in China; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; and other risks described from time to time in the Company's SEC filings, including its annual report on Form 20-F dated March 7, 2008. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the Singapore Exchange Securities Trading Limited (SGX-ST). Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Contact Information: Investor Relations Contact: Tham Kah Locke Vice President of Corporate Finance Tel: (65) 6824 7788 Fax: (65) 6720 7826 email: Media Contact: Lisa Lavin Deputy Director of Corporate Communications Tel: (208) 939 3104 Fax: (208) 939 4817 email: