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STATS ChipPAC Completes Full Qualification of Fan-in Package-on-Package Technology
Electrical Samples Are Now Available With Production Volumes Expected to Ramp by the End of 2008
| Source: STATS ChipPAC
UNITED STATES--(Marketwire - May 12, 2008) - SINGAPORE -- 5/13/2008 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading
semiconductor test and advanced packaging service provider, today announced
it has completed full internal qualification of its Fan-in
Package-on-Package (FiPoP) technology. Fully functional electrical samples
are now available to customers, and production volumes are expected to ramp
by the end of 2008.
FiPoP technology addresses the industry demand for a smaller, thinner
stacked solution with increased device integration for advanced mobile
phone and handheld applications. In conventional Package-on-Package (PoP)
designs, the top package must be the same size as the bottom package in
order to interconnect the top package to the bottom package during the
board level reflow process. With consumer demand for increased performance
in thinner and smaller portable handheld devices, the conventional PoP
approach presents physical limitations in the reduction of the overall
package size and height while maintaining acceptable surface mount yields
and reliability levels.
FiPoP allows multiple logic, analog and memory die to be integrated in the
bottom PoP package and accommodates larger die sizes in a reduced footprint
as compared to conventional PoP designs. The key to the FiPoP design is an
exposed array of land pads on the top center surface of the package,
instead of a peripheral array around the top of the bottom package
substrate as found in a conventional PoP. This eliminates the requirement
of the top and bottom packages to be the same size, resulting in greater
flexibility in stacking thinner, smaller memory packages on top. In
addition, the FiPoP structure reduces package warpage and related board
mount issues, as well as enabling finer ball pitch interconnect between the
top and bottom package (down to 0.4mm pitch) and high package-to-package
interconnect pincount.
"STATS ChipPAC has internally qualified both top and bottom packages in
various body sizes. This qualification opens the door for a multitude of
package configurations and provides semiconductor companies a flexible
solution to meet their integration and miniaturization demands much sooner
and at a lower overall cost," said Dr. Han Byung Joon, STATS ChipPAC's
Executive Vice President and Chief Technology Officer.
The inherent design of FiPoP provides a more balanced structure that
achieves high final assembly yields, meets rigorous package level
reliability requirements and performs well above JEDEC board level
reliability requirements for mobile phone and handheld applications.
Forward-Looking Statements
Certain statements in this release are forward-looking statements that
involve a number of risks and uncertainties that could cause actual events
or results to differ materially from those described in this release.
Factors that could cause actual results to differ include, but are not
limited to, general business and economic conditions and the state of the
semiconductor industry; level of competition; demand for end-use
applications products such as communications equipment and personal
computers; decisions by customers to discontinue outsourcing of test and
packaging services; our reliance on a small group of principal customers;
our continued success in technological innovations; pricing pressures,
including declines in average selling prices; availability of financing;
prevailing market conditions; our ability to meet the applicable
requirements for the termination of registration under the Exchange Act;
our ability to meet specific conditions imposed for the continued listing
or delisting of our ordinary shares on the SGX-ST; our substantial level of
indebtedness; potential impairment charges; delays in acquiring or
installing new equipment; adverse tax and other financial consequences if
the South Korean taxing authorities do not agree with our interpretation of
the applicable tax laws; our ability to develop and protect our
intellectual property; rescheduling or canceling of customer orders;
changes in our product mix; intellectual property rights disputes and
litigation; our capacity utilization; limitations imposed by our financing
arrangements which may limit our ability to maintain and grow our business;
changes in customer order patterns; shortages in supply of key components;
disruption of our operations; loss of key management or other personnel;
defects or malfunctions in our testing equipment or packages; changes in
environmental laws and regulations; exchange rate fluctuations; regulatory
approvals for further investments in our subsidiaries; majority ownership
by Temasek Holdings (Private) Limited ("Temasek") that may result in
conflicting interests with Temasek and our affiliates; unsuccessful
acquisitions and investments in other companies and businesses; labor union
problems in South Korea; uncertainties of conducting business in China and
other countries in Asia; natural calamities and disasters, including
outbreaks of epidemics and communicable diseases; and other risks described
from time to time in the Company's SEC filings, including its annual report
on Form 20-F dated March 7, 2008. You should not unduly rely on such
statements. We do not intend, and do not assume any obligation, to update
any forward-looking statements to reflect subsequent events or
circumstances.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) is
a leading service provider of semiconductor packaging design, assembly,
test and distribution solutions in diverse end market applications
including communications, digital consumer and computing. With global
headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices in 10 different
countries. STATS ChipPAC is listed on the Singapore Exchange Securities
Trading Limited (SGX-ST). Further information is available at
www.statschippac.com. Information contained in this website does not
constitute a part of this release.