Contact Information: For further information: Media: Jeff Ferry Infinera Tel (408) 572-5213 jferry@infinera.com Investors: Bob Blair Infinera Tel. (408) 716-4879 bblair@infinera.com
Infinera Wins Major European DWDM Network
Deutsche Telekom to Deploy Infinera DWDM System in Pan-European Network
| Source: Infinera
SUNNYVALE, CA--(Marketwire - June 16, 2008) - Infinera (NASDAQ : INFN ) won an RFQ at
Deutsche Telekom for its pan-European network. DT will deploy the Infinera
system to take advantage of the benefits of Infinera's Digital Optical
Networks architecture, including significantly improved scalability,
flexibility, and speed of service delivery. These benefits are enabled by
Infinera's pioneering use of large-scale photonic integrated circuits, or
PICs, combining the functions of dozens of discrete optical devices into a
single pair of chips.
Deutsche Telekom is one of the world's largest telecom carriers. As part of
its global network DT's pan-European network spans almost nine thousands
kilometers and links Germany with most major European markets. DT selected
Infinera after a thorough RFQ process in which many of the world's largest
optical networking suppliers participated.
DT chose Infinera for the unique benefits and advantages of Infinera's
PIC-based Digital Optical Networks architecture, including the new ILS2
(Infinera Line System 2) system. This system offers up to 160 DWDM (dense
wavelength division multiplexing) channels in the C-band, extends optical
reach to 2500 kilometers, and enables future capacity scalability up to 8
Tbps on a fiber. [See Infinera news release Infinera Introduces New Line
System, Sets New Standard for Capacity, published on June 9, 2008]. The
ILS2 system works with Infinera's current photonic integrated circuits
(PICs), which put 100 Gigabits/second (Gb/s) of DWDM capacity on a pair of
chips, and will be compatible with future generations of Infinera PICs,
including the 400 Gb/s PICs Infinera announced in February.
Infinera's Digital Optical Networks architecture exploits the use of PICs
to create a highly scalable, flexible, and cost-effective architecture with
an unrivalled capability to enable network operators to deliver services,
including highly differentiated services, quickly and flexibly in response
to customer demands. Infinera's Bandwidth Virtualization™ enables a wide
range of optical services to be delivered over the same optical
infrastructure, by decoupling the service from the underlying optical
infrastructure.
Meeting the Challenges of Growth
Like many network operators, DT needs to meet the challenges of rising
demand for bandwidth, which are not matched by a similar increase in
revenue per bit. Infinera's digital architecture enables DT to meet those
challenges more quickly and more flexibly than before and also to
differentiate itself in the marketplace, not only by the speed of the
Infinera solution, but by the new services that are enabled. Infinera's
GMPLS service intelligence gives network operators greater power to segment
portions of their network, offering specific resources and services to
specific customers.
Leveraging the unique capabilities of photonic integration, Infinera
systems offer great scalability, critically important for network operators
in light of the rapid growth in bandwidth demand from Internet
applications. Infinera believes that without a roadmap for growth in
capacity per chip, the industry cannot scale to keep up with traffic if
exponential growth in bandwidth demand continues. In February, Infinera
announced its roadmap for photonic integration, which envisages PIC
capacity doubling every three years. Next year Infinera will produce PICs
with 400 Gb/s of capacity on a pair of chips, and believes that Terabit
PICs will follow thereafter. Each future generation of PICs will integrate
more optical devices, delivering significant benefits in terms of
scalability, simplicity of operation, space and power consumption, and
reliability.
"We selected the Infinera system to prepare for the next generation of
international network operations and to help our customers to take
advantage of this innovative and highly efficient solution with the most
flexibility, quickest service provisioning and complete remote
capabilities," said Wolf Pueschner, of Global Networks, Deutsche Telekom.
"We are thrilled that DT, one of the world's largest and most influential
network operators, has chosen Infinera's ILS2 system for the backbone of
this new network," said Infinera CEO Jagdeep Singh. "This is a tremendous
validation of our Digital Optical Networks architecture and of the
innovative photonic integration which is at the heart of all our systems.
This award makes clear that the benefits of PIC-based digital optical
networks are powerful and realizable by carriers across the full range of
geographies, markets, and applications."
About Infinera
Infinera provides Digital Optical Networking systems to telecommunications
carriers worldwide. Infinera's systems are unique in their use of a
breakthrough semiconductor technology: the photonic integrated circuit
(PIC). Infinera's systems and PIC technology are designed to provide
optical networks with simpler and more flexible engineering and operations,
faster time-to-service, and the ability to rapidly deliver differentiated
services without reengineering their optical infrastructure. For more
information, please visit www.infinera.com.
Forward Looking Statements
This press release contains certain forward-looking statements based on
current expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available to
Infinera as of the date hereof; and actual results could differ materially
from those stated or implied, due to risks and uncertainties.
Forward-looking statements include statements regarding Infinera's
expectations, beliefs, intentions or strategies regarding the future such
as the benefits, application and capabilities of Infinera's Digital Optical
Networks architecture, including significantly improved scalability,
flexibility, and speed of service delivery, our belief that DT will deploy
our ILS2 system, and that we will pass DT's integration, validation and
acceptance testing for the ILS2 system, the unique benefits and advantages
of Infinera's PIC-based Digital Optical Networks architecture and the ILS2
system, including its capacity, reach and scalability and its compatible
with future generations of Infinera PICs, Infinera's belief that our
architecture exploits the use of PICs to create significant benefits for
network operators, Infinera's belief that Infinera's digital architecture
is designed to enable DT to meet its business challenges more quickly and
more flexibly than before and will enable DT to differentiate itself in the
marketplace, Infinera's belief that without a roadmap for growth in
capacity per chip, the industry cannot scale to keep up with traffic if
exponential growth in bandwidth demand continues, Infinera's belief that
GMPLS service intelligence is designed to give network operators greater
power to segment portions of their network and offer specific resources and
services to specific customers, Infinera's beliefs regarding the
scalability of PIC capacity and our ability to produce these PICs with
increased functionality and the ability to provide additional benefits in
the future, Infinera's belief that the DT award is a validation of our
Digital Optical Networks architecture and photonic integration, Infinera's
belief that the DT award makes clear that the benefits of PIC-based digital
optical networks are powerful and realizable by carriers across the full
range of geographies, markets, and applications, and other statements that
can be identified by forward-looking words such as "anticipated,"
"believed," "could," "estimate," "expect," "intend," "may," "should,"
"will," and "would" or similar words. The risks and uncertainties that
could cause our results to differ materially from those expressed or
implied by such forward-looking statements include aggressive business
tactics by our competitors, our dependence on a single product, our ability
to protect our intellectual property, claims by others that we infringe
their intellectual property, our manufacturing process is very complex,
product performance problems we may encounter, our dependence on sole or
limited source suppliers, our ability to respond to rapid technological
changes, our ability to maintain effective internal controls, the ability
of our contract manufacturers to perform as we expect, general political,
economic and market conditions and events, including war, conflict or acts
of terrorism; and other risks and uncertainties described more fully in our
annual report filed on Form 10K filed with the SEC on February 19, 2008 and
our public announcements, reports to stockholders and other documents filed
with or furnished to the Securities and Exchange Commission. These
statements are based on information available to us as of the date hereof
and we assume no obligation to update the
forward-looking statements included in this press release, whether as a
result of new information, future events or otherwise.