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STATS ChipPAC Offers Innovative USB Module for NAND Flash Memory Applications
New Design Utilizes SiP and 3D Technology to Integrate Memory, Controller and Passives in a Single, Cost-Effective Solution
| Source: STATS ChipPAC
SINGAPORE -- 08/19/2008, UNITED STATES--(Marketwire - August 18, 2008) - STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES : S24 ), a leading
semiconductor test and advanced packaging service provider, today announced
an innovative USB (Universal Serial Bus) module for NAND flash memory
applications.
STATS ChipPAC's new USB flash drive design utilizes System-in-Package (SiP)
and three dimensional (3D) die stacking technology to integrate NAND flash
memory die, controller and passives onto a single packaging substrate for
a cost-effective module solution. The USB module has the flexibility to
accommodate multiple die configurations and can be customized for each
customer or end application. Integrating all of the key components of a USB
flash drive into a single package saves considerable space and allows for
more effective signal routing at a lower overall cost.
In a typical design for a USB drive, the NAND flash memory die and
controller are packaged in Thin Small Outline Package (TSOP), Quad Flat
Pack (QFP) or Ball Grid Array (BGA) packages. These packages may contain
stacked dies, depending on the memory density requirements of the end
application. The discrete NAND flash memory and controller along with
passives are then mounted onto a printed circuit board (PCB) using surface
mount technology. This normally consumes most of the usable area allowed by
the form factor of the USB flash drive.
"Semiconductor manufacturers in the NAND flash memory market face an
intense challenge to increase memory density within a limited form factor
and deliver a competitively priced end product to consumers," said Dr. Han
Byung Joon, Executive Vice President and Chief Technology Officer, STATS
ChipPAC. "Integrating the key components of a USB drive at the packaging
level provides a number of benefits including increased design flexibility
and advanced die stacking capability along with a reduction in size and
overall cost. With our combined experience in memory card manufacturing,
SiP and 3D integration technology and our advanced design capabilities, we
have developed, qualified and ramped to production an innovative USB module
which offers our customers a new, cost-effective NAND flash memory
solution."
The innovative USB module design is the latest addition to the Company's
portfolio of solutions for removable solid-state storage applications.
STATS ChipPAC offers a variety of memory card formats which utilize the
most up-to-date technologies and processes unique to memory cards,
including integrated curve-cutting, labeling, mechanical card assembly and
card packaging. In addition to assembly, STATS ChipPAC offers memory card
test services with dedicated resources to support test development.
Dr. Han continued, "The key to maximizing the full value of packaging
integration in removable solid-state storage devices is to provide a
complete solution of design, test development, advanced packaging, memory
test, card assembly and card test. STATS ChipPAC stands out in the
outsourced semiconductor assembly and test market because of our focus on
being a full turnkey service provider."
Forward-Looking Statements
Certain statements in this release are forward-looking statements that
involve a number of risks and uncertainties that could cause actual events
or results to differ materially from those described in this release.
Factors that could cause actual results to differ include, but are not
limited to, general business and economic conditions and the state of the
semiconductor industry; level of competition; demand for end-use
applications products such as communications equipment and personal
computers; decisions by customers to discontinue outsourcing of test and
packaging services; our reliance on a small group of principal customers;
our continued success in technological innovations; pricing pressures,
including declines in average selling prices; availability of financing;
prevailing market conditions; our ability to meet the applicable
requirements for the termination of registration under the Exchange Act;
our ability to meet specific conditions imposed for the continued listing
or delisting of our ordinary shares on the Singapore Exchange Securities
Trading Limited (SGX-ST); our substantial level of indebtedness; potential
impairment charges; delays in acquiring or installing new equipment;
adverse tax and other financial consequences if the South Korean taxing
authorities do not agree with our interpretation of the applicable tax
laws; our ability to develop and protect our intellectual property;
rescheduling or canceling of customer orders; changes in our product mix;
intellectual property rights disputes and litigation; our capacity
utilization; limitations imposed by our financing arrangements which may
limit our ability to maintain and grow our business; changes in customer
order patterns; shortages in supply of key components; disruption of our
operations; loss of key management or other personnel; defects or
malfunctions in our testing equipment or packages; changes in environmental
laws and regulations; exchange rate fluctuations; regulatory approvals for
further investments in our subsidiaries; majority ownership by Temasek
Holdings (Private) Limited ("Temasek") that may result in conflicting
interests with Temasek and our affiliates; unsuccessful acquisitions and
investments in other companies and businesses; labor union problems in
South Korea; uncertainties of conducting business in China and other
countries in Asia; natural calamities and disasters, including outbreaks of
epidemics and communicable diseases; and other risks described from time to
time in the Company's SEC filings, including its annual report on Form 20-F
dated March 7, 2008. You should not unduly rely on such statements. We do
not intend, and do not assume any obligation, to update any forward-looking
statements to reflect subsequent events or circumstances.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions in diverse end market
applications including communications, digital consumer and computing. With
global headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices in 10 different
countries. STATS ChipPAC is listed on the SGX-ST. Further information is
available at www.statschippac.com. Information contained in this website
does not constitute a part of this release.