Cascade Microtech, Inc. and SUSS MicroTec AG Agree to Pursue Technology Alliance
Strategic Alliance Would Allow Industry Leaders to Collaborate on 3D Integration Requirements for Semiconductor Market
| Source: Cascade Microtech
BEAVERTON, OR and GARCHING/MUNICH, GERMANY--(Marketwire - January 28, 2010) - Cascade
Microtech, Inc. (NASDAQ : CSCD ), a worldwide leader in the precise
electrical and mechanical measurement and test of integrated circuits (ICs)
and other small structures, and SUSS MicroTec AG, a leading supplier of
equipment and process solutions for the semiconductor industry and related
markets, announced today that they have agreed to pursue a strategic
alliance to address the growing device complexities of emerging
semiconductor technologies such as 3D TSV manufacturing and test.
Since the 1960s, the lithographic scaling of chips, often referred to as
Moore's Law, has enabled semiconductor companies to exponentially increase
chip speed, functionality and complexity while reducing cost at the same
time. As companies drive transistor dimensions below 32 nm, the performance
and cost improvements of chip scaling become less favorable and
interconnects -- the tiny wires between transistors -- increasingly limit
any performance gains. To address these interconnect bottlenecks, emerging
3D methodologies stack one or more chips or wafers to route between layers.
Adoption of 3D TSV (Through-Silicon Via) is the ultimate in 3D integration
providing higher performance, reduced noise, smaller device form factor,
and modularity in construction at potentially lower cost.
By pursuing a strategic alliance, the two companies hope to bring
innovative approaches to the 3D TSV manufacturing processes. Both companies
expect to use their associations with leading research organizations such
as IMEC, as well as industry partnerships, to gain insight into this
cutting-edge methodology driving beyond Moore's Law. Further collaboration
with device and reliability experts would allow the alliance to address the
complexities and interactions of semiconductor bonding and test probing for
next-generation semiconductor devices.
"SUSS MicroTec shares Cascade Microtech's commitment to develop the most
advanced technologies for the continued improvement of semiconductor
technologies," said Frank P. Averdung, President and CEO of SUSS MicroTec
AG. "The comprehensive knowledge of the two companies will enable both
companies to better address the issues inherent in 3D integration."
"Our proposed strategic alliance with SUSS MicroTec would reinforce Cascade
Microtech's commitment to develop practical solutions for leading-edge
technologies that increasingly rely on new structures for continued
performance improvement," said F. Paul Carlson, Chairman and CEO of Cascade
Microtech, Inc. "We look forward to collaborating with SUSS MicroTec on
innovative ways to characterize and evaluate new design methodologies and
manufacturing processes, which will benefit our common customers, as well
as the industries we serve."
About SUSS MicroTec AG
SUSS MicroTec (listed in Deutsche Börse AG's Prime Standard) is a leading
supplier of process and test solutions for markets such as 3D Integration,
Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor.
High-quality solutions enable customers to increase process performance
while reducing cost of ownership. SUSS MicroTec supports more than 8,000
installed mask aligners, coaters, bonders and probe systems with a global
infrastructure for applications and service. SUSS MicroTec is headquartered
in Garching near Munich, Germany. For more information, please visit
http://www.suss.com.
About Cascade Microtech, Inc.
Cascade Microtech, Inc. (NASDAQ : CSCD ) is a worldwide leader in the precise
electrical and mechanical measurement and test of integrated circuits (ICs)
and other small structures. For technology businesses and scientific
institutions that need to evaluate small structures, Cascade Microtech
delivers access to electrical data from wafers, integrated circuits (ICs),
IC packages, circuit boards and modules, MEMS, biological structures, 3D
TSV, LED devices and more. Cascade Microtech's leading-edge semiconductor
production test products include unique probe cards and test sockets that
reduce manufacturing costs of high-speed and high-density semiconductor
chips. For more information visit www.cascademicrotech.com.
Forward-Looking Statements Disclosure
This press release contains statements, including the statements by Frank P.
Averdung and Paul Carlson and statements regarding the Company's
expectations as to the results of the proposed alliance between the Company
and Suss MicroTec AG that are "forward-looking" statements within the
meaning of the Securities Litigation Reform Act of 1995. Words such as
"expects," "anticipates," "intends," "plans," "should," "believes,"
"estimates" and variations of such words and similar expressions are
intended to identify such forward-looking statements. Such statements are
based on current expectations and projections about the proposed alliance
based in part on assumptions made by management. These statements are not
guarantees of future performance and involve risks and uncertainties that
are difficult to predict. Therefore, actual outcomes and results may differ
materially from what is expressed or forecasted in such forward-looking
statements due to numerous factors, including the potential inability to
realize expected benefits; potential diversion of management's attention
from existing business and other risks and uncertainties as discussed from
time to time in the Company's Securities and Exchange Commission filings
and reports, including the Company's Annual Report on Form 10-K. In
addition such statements could be affected by general industry and market
conditions and growth rates and general domestic and international economic
conditions. Such forward-looking statements speak only as of the date on
which they are made and the Company does not undertake any obligation to
update any forward statement to reflect events or circumstances after the
date of this release.