SINGAPORE -- 1/28/2011, UNITED STATES--(Marketwire - January 27, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today announced that it recently received "Best Supplier Award" from Samsung Semiconductor, Inc., a wholly owned subsidiary of Samsung Electronics Co., Ltd. Samsung Semiconductor sells advanced components that are widely used in the computer, mobile and entertainment markets. This is the second consecutive year that STATS ChipPAC has achieved Samsung's Best Supplier Award.

Dr. Oh-Hyun Kwon, President of Samsung Semiconductor, presented the award and commended STATS ChipPAC for its performance. The supplier awards are presented each year to the top companies in Samsung's worldwide supply chain. The award is part of their supplier evaluation program which was established to build a win-win relationship between Samsung and its suppliers. Performance is evaluated in terms of overall service in the areas of quality, cost, customer satisfaction, advanced technical support, yield performance, availability and delivery.

STATS ChipPAC supports two major divisions of Samsung Semiconductor: The System LSI and Memory Divisions. STATS ChipPAC provides full turnkey packaging and test services for products which are found in a wide range of digital devices such as mobile phones, computers and a wide range of handheld devices such as MP3 players and smartphones.

"We are proud to be a strategic supplier to Samsung and to be recognised for our achievements in providing full turnkey services for a wide range of packages, from advanced flip chip and ball grid array devices to multi-chip packages and modules. We have worked diligently over the last year to deliver the highest level of customer service and operational excellence with innovative, cost competitive services and solutions. It is gratifying to have these efforts recognised by such a highly regarded company as Samsung," said Hal Lasky, Executive Vice President and Chief Sales Officer, STATS ChipPAC.

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; shortages in supply of key components; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"); and other risks described from time to time in the Company's filings with the U.S. Securities and Exchange Commission, including its annual report on Form 20-F dated 5 March 2010. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at Information contained in this website does not constitute a part of this release.

Contact Information:

Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance
Tel: (65) 6824 7788
Fax: (65) 6720 7826