3rd Asia Symposium on Quality Electronic Design (ASQED) Announces Program; Convenes July 19-20, Kuala Lumpur, Malaysia

SAN JOSE, CA and KUALA LUMPUR, MALAYSIA--(Marketwire - May 18, 2011) - The third Asia Symposium on Quality Electronic Design (ASQED) today announced its 2011 program consisting of several keynotes by industry leaders and university experts, tutorials and over 50 technical presentations

ASQED is being held on July 19-20, 2011 in Kuala Lumpur, Malaysia. ASQED plays a critical role in promoting quality-based electronic design and manufacturing in Asia and plans to be an integral part of establishing a communication link between semiconductor, nano-electronic, bio-electronic, MEMS (microelectromechanical) and NEMS (nanoelectromechanical) systems, and photovoltaic (PV) technologies and disciplines such as design, manufacturing, test and packaging.

Powerful Keynotes Headline Conference
ASQED keynote sessions are sponsored by Synopsys and include:

• Nanotechnology and the Challenges Facing Designers of Circuits and Systems
  Prof. Arokia Nathan
  Chair of Nanotechnology, London Centre for Nanotechnology,
  University College London, England

• Electronics for Energy Management
  Dr. Bernard Courtois
  Director of CMP and TIMA, France

• The Packaging Technology Domain
  Prof. Younggap You
  Dean of College of Electrical and Computer Engineering, Chungbuk National University, Korea

• Challenges in Interconnection
  Dr. ChoonHeung Lee
  Head of Corp. Technology, Amkor, Korea

• Advances in High Density Interconnections-Promoting Innovations and Lower Costs
  Happy Holden
  Chief Technical Officer, Foxconn Advanced Technology, Taiwan

Tutorials
ASQED is pleased to offer the following tutorials by industry experts:

• A Tool Box for Successful 3D Integration
  Mark Scannell
  Program Director, 3D Integration
  CEA - Léti, France

• Modern 3D Packaging Technologies Driving the Need for IC, Package and Printed Circuit Board (PCB) Co-Design Methodologies
  John Park
  Methodology Architect
  Mentor Graphics, USA

• Memory Packaging Challenges and Approaches for the Evolving World of the Portable Client and Cloud
  Richard Crisp
  Principal Technologist
  Tessera, USA

• 3D Silicon Interposer and Through Silicon Via (TSV): Application, Requirement, Infrastructure and Technologies
  Farhang Yazdani
  President and CTO
  BroadPak Corporation, USA

Technical Sessions
The ASQEDtechnical sessions consist of over 50 papers by engineers and researchers worldwide.

About ISQED
ASQED is the third event organized by the International Society for Quality Electronic Design (www.ISQED.com) in Asia. Conference proceedings are published by the IEEE.
Please visit http://www.asqed.com for more information and to register.

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