DGAP-News: SÃSS MicroTec AG / Key word(s): Product Launch
SÃSS MicroTec AG: SUSS MicroTec launches XBS300, the next generation
Temporary Bonder for 200mm and 300mm High-Volume Production
05.12.2011 / 17:32
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PRESS RELEASE
SUSS MicroTec launches XBS300, the next generation Temporary Bonder for
200mm and 300mm High-Volume Production
Garching, GERMANY, December 5, 2011 - SUSS MicroTec, a leading supplier of
equipment and process solutions for the semiconductor and related markets,
launched the XBS300 Temporary Bonder, SUSS MicroTec's latest generation of
high volume manufacturing temporary bond systems. This Bond Cluster is
configured to temporarily bond 200mm and 300mm wafers for 3D integration
applications as well as other processes that require thin wafer handling.
SUSS MicroTec's XBS300 offers a high throughput capability resulting in a
superior cost-of-ownership as well as a sophisticated process control to
meet customers' demands and expectations for high volume temporary bonding
applications. The temporary bonding of wafers is one of the crucial process
steps of 3D integration.
The XBS300 supports all currently available temporary bonding adhesives.
Its versatility allows a variety of process configurations suited for very
low force bonds such as the Thin Materials (TMAT) process or the 3M(TM)
Wafer Support System (WSS) as well as higher force thermo-compression bonds
as used in the BrewerScience(R) ZoneBOND(TM) process. Key process steps for
temporary bonding with the XBS300 include adhesive and release layer
deposition, temporary bonding and curing and integrated metrology to
determine the total thickness variation (TTV).
At this point in time a number of renowned material manufacturers are
working on the development of new temporary bonding adhesives that are
fully compatible with SUSS' XBS300 equipment platform.
'The XBS300 Temporary Bonding System is our answer to an increasing demand
for processing systems that meet the requirements of future High Volume
Production expected for 2013,' says Frank P. Averdung, President and CEO of
SÃSS MicroTec AG. 'The XBS300 is based on our ACS300 Gen2 cluster platform,
already established in the industry as proven workhorse for high volume
production, ensuring high levels of efficiency and reliability. The
utilization of this common platform strategy is one of the major gains from
the geographic consolidation of three product lines under one roof in our
Sternenfels facility. With the XBS300 - our latest innovation - we round
off a product portfolio which perfectly addresses the future requirements
of our customers.'
The first tool has already been delivered to a world leading IDM with the
installation currently in progress.
About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading
supplier of equipment and process solutions for microstructuring in the
semiconductor industry and related markets. In close cooperation with
research institutes and industry partners SUSS MicroTec contributes to the
advancement of next-generation technologies such as 3D Integration and
nanoimprint lithography as well as key processes for MEMS and LED
manufacturing. With a global infrastructure for applications and service
SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS
MicroTec is headquartered in Garching near Munich, Germany. For more
information, please visit http://www.suss.com.
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com
End of Corporate News
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Language: English
Company: SÃSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir@suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart
End of News DGAP News-Service
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148682 05.12.2011
DGAP-News: SÃSS MicroTec AG: SUSS MicroTec launches XBS300, the next generation Temporary Bonder for 200mm and 300mm High-Volume Production
| Source: EQS Group AG