DGAP-News: SÃSS MicroTec AG / Key word(s): Product Launch
SUSS MicroTec launches XBC300 Gen2: New Platform for permanent Wafer
Bonding, Debonding and Cleaning
06.02.2012 / 17:35
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PRESS RELEASE
SUSS MicroTec launches XBC300 Gen2: New Platform for permanent Wafer
Bonding, Debonding and Cleaning
Garching, GERMANY, February 6, 2012 - SUSS MicroTec, a leading supplier of
equipment and process solutions for the semiconductor and related markets,
launched the XBC300 Gen2, a high volume manufacturing platform for advanced
3D processing. The new bonding equipment can be used for permanent wafer
bonding, or debonding and cleaning of 200mm and 300mm wafers. It is
designed for production as well as process development.
Configurable with a wide selection of process modules, the new universal
bonder platform is suitable for all major permanent bonding as well as
mechanical debonding processes at room temperature. The corresponding
cleaning processes for 3D integration and 3D packaging are also supported.
The high force bonding processes that can be run on the XBC300 Gen2 include
Cu-Cu, polymer, fusion and hybrid bonding.
When configured as a debonder and cleaner the XBC300 Gen2 is the
complementary platform to SUSS MicroTec's XBS300 temporary wafer bonder,
which was launched in December 2011. Device wafers are temporarily bonded
to a carrier in the XBS300 and are debonded on the XBC300 Gen2 after
passing all the backside processing steps. The XBC300 Gen2 debonder /
cleaner is configured for handling both, carrier wafers as well as film
frames. It allows for room temperature mechanical debonding and subsequent
cleaning of carriers and device wafers.
'The XBC300 Gen2 allows complete process flexibility with full automation
and offers our customers a superior cost of ownership. While the first
generation XBC300 only offered configurations with up to three process
modules, the new generation can be equipped with up to six modules,
enabling the high throughput required in volume manufacturing. ', says
Frank P. Averdung, President and CEO of SÃSS MicroTec AG. 'With the XBS300
and the XBC300 Gen2 we offer our customers a complete, state-of-the-art set
of automated equipment for thin wafer handling in 3D integration and 3D
packaging processes.'
About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading
supplier of equipment and process solutions for microstructuring in the
semiconductor industry and related markets. In close cooperation with
research institutes and industry partners SUSS MicroTec contributes to the
advancement of next-generation technologies such as 3D Integration and
nanoimprint lithography as well as key processes for MEMS and LED
manufacturing. With a global infrastructure for applications and service
SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS
MicroTec is headquartered in Garching near Munich, Germany. For more
information, please visit http://www.suss.com.
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com
End of Corporate News
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Language: English
Company: SÃSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir@suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart
End of News DGAP News-Service
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155603 06.02.2012
DGAP-News: SUSS MicroTec launches XBC300 Gen2: New Platform for permanent Wafer Bonding, Debonding and Cleaning
| Source: EQS Group AG