SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced the launch of its Quad Flat No-Lead (QFN) package design kit for Agilent Technologies' Advanced Design System (ADS).

The QFN package design kit (PDK) enhances package modeling and simulation accuracy with Agilent's ADS electronic design automation (EDA) software for radio frequency (RF), microwave and high-speed digital applications for RF semiconductors.

"As RF devices become more compact with increasing design complexities and the integration of multiple integrated circuit (IC) technologies, the accuracy and cycle time required for package modeling and simulation become a critical factor in time-to-market and overall cost. By utilizing the QFN PDK with Agilent's ADS software, our customers will be able to perform fast, accurate simulation in different circuit layout scenarios to achieve first-pass design success. This is increasingly important as RF ICs continue to shrink in dimension and operate at higher frequencies," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. 

"ADS enables IC designers to identify and resolve complex integration issues early in the design process, before the fabrication of wireless components like power amplifiers and RF front-end modules," said Joe Civello, ADS Product Manager for Agilent EEsof EDA. "The combination of STATS ChipPAC's QFN package design kit and our ADS software will provide customers with the information they need to quickly make design decisions to position their RF devices for a successful production ramp."

STATS ChipPAC's package design kit contains models for 3x3, 4x4, 5x5, 6x6, and 7x7 QFN package sizes and was developed for use with ADS 2009 Update 1 and ADS 2011 software in both Windows and Linux versions.

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, the timing and impact of the expected closure of the Thailand Plant as well as the estimated associated cost for the closure; the amount of the property damage and business interruption insurance claim due to flooding of the Thailand Plant; the ability to shift production to other manufacturing locations, shortages in supply of key components and disruption in supply chain; general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at Information contained in this website does not constitute a part of this release.

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