ANDOVER, MA--(Marketwired - Dec 11, 2013) - Vicor Corporation (NASDAQ: VICR) today announced that EDN has named the company's ChiP power component packaging technology as one of the "Hot 100 Products of 2013." The 2013 EDN Hot 100 highlights the electronic industry's most significant products of the year based on innovation, usefulness and popularity.

Leveraging advanced magnetic structures integrated within high density interconnect (HDI) substrates with power semiconductors and control ASICs, ChiP-based power components provide unprecedented power density and superior thermal management. Vicor power components based on the ChiP platform enable power engineers to achieve low cost power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably.

"Vicor's ChiP platform facilitates a modular power system design methodology that equips designers to achieve high performance, cost-effective power systems from AC or DC sources to the Point of Load using proven building blocks," said Stephen Oliver, VP of VI Chip product line, Vicor. "This honor from EDN -- Vicor's second consecutive EDN Hot 100 recognition -- is a testament to our significant investment in power electronics innovation and our continued commitment to helping our customers achieve the highest levels of power performance and ease of use."

"Of the many thousands of products announced during the past year, the EDN Hot 100 are the products that especially caught the attention of our editors and readers. We are pleased to share the tradition of showcasing these technologies as we celebrate the 20th anniversary of this program," said Rich Pell, Executive and Chief Technical Editor, EDN.

The complete index of EDN's Hot 100 products can be found online at EDN's website.

For more information about Vicor's ChiP platform, visit Vicor's website.

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About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high-performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point of load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics.

Vicor, VI Chip and FPA are trademarks of Vicor Corporation.

Contact Information:


Colin Boroski
Rainier Communications
508-475-0025 x 142