TSV Revealer Achieves Highest Uniformity and Fast Etch Rates; Provides Lowest CoO, Making 3D TSVs More Economically Feasible
HORSHAM, PA--(Marketwired - July 22, 2014) - Solid State Equipment LLC (SSEC), a leading provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment. The 3D InCites Awards recognize achievements to further the commercialization of 2.5D and 3D IC technologies. SSEC received the award for the WaferEtch TSV Revealer tool, which is a single wafer wet processing platform for 3D IC and interposer wet etching applications designed to reduce process and capital equipment costs. The WaferEtch features superior uniformity of silicon thickness (as low as -/+ 0.7%) and high throughput.
"Bringing 3D ICs to high-volume manufacturing is a requirement for the industry to move forward into the next technology node," said Erwan Le Roy, Marketing Vice President at SSEC. "SSEC's WaferEtch TSV Revealer helps to achieve this through integrating a low-cost wet etch process with metrology for performing thickness measurement. Our system replaces four tools with one (CMP, silicon thickness measurement, plasma etch, and clean), so we are able to achieve this at the lowest cost to the manufacturer."
The 3D InCites Awards were established in 2013 to recognize achievements to further the commercialization of 2.5D and 3D IC technologies. The 2014 3D InCites Awards were presented at a breakfast ceremony hosted by Impress Labs on Thursday, July 10, 2014, at the Impress Lounge during SEMICON West. The event featured guest speaker Bryan Black, Senior Fellow, AMD, who has led AMD's die stacking program for the past seven years. Black talked about the future of die stacking and where the benefits lie within the context of mainstream computing CPUs, APUs, and GPUs.
This year's event was co-promoted by 3D InCites, the premier online content source for reliable 3D technology information; SEMI, the global industry association serving the nano- and microelectronics manufacturing supply chains; and TechSearch International, the leading market research firm for advanced semiconductor packaging technology.
About Solid State Equipment LLC
Founded in 1965 and headquartered in Horsham, Pa., Solid State Equipment LLC (DBA SSEC) is a manufacturer of single-wafer wet processing equipment for the semiconductor industry. Solid State Equipment maintains worldwide sales and technical service offices in Horsham, Pa.; San Jose, Calif.; Regensburg, Germany; Cramlington, England; Taiwan, R.O.C.; Shanghai, P.R.C; Woodlands, Singapore; Gyeonggi, R.O.K.; and Laguna, Philippines. www.ssecusa.com
About 3D InCites
3D InCites is an online content source founded in 2009 in an effort to stir up interest in 3D IC integration and 3D packaging technologies. For 3D integration to happen, open collaboration across the supply chain is required. Therefore, 3D InCites strives to inform key decision-makers about progress in technology development, design, standards, and infrastructure in order to realize commercial production of 2.5D and 3D technologies. 3D InCites is powered by Impress Labs, a global creative and marketing communications agency specializing in building brands for technology companies in the semiconductor, solar energy and life science industries. For more information, visit www.3DInCites.com.