DGAP-News: Dialog Semiconductor Plc. / Key word(s): Product
Launch/Miscellaneous
Dialog Semiconductor Plc.: Dialog Semiconductor Expands Bluetooth(R)
Smart SoC Family with Application-Optimised Versions
24.03.2015 / 08:01
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Three new SmartBond(TM) ICs include smallest, lowest power, devices for the
IoT with fully hosted wireless charging and remote control units, including
flash variants
London UK, 24 March 2015 - Dialog Semiconductor plc (FWB:DLG), a provider
of highly integrated power management, AC/DC power conversion, solid state
lighting (SSL) and Bluetooth Smart wireless technology, announces three
additions to its successful SmartBond family of ultra-low power, Bluetooth
Smart System-on-Chip (SoC) integrated circuits. The devices, aimed at high
volume, high growth consumer markets, are the smallest and lowest power
wireless connectivity solutions for the Internet-of-Things (IoT). Versions
optimised for wireless charging and remote control units (RCUs) address
markets that will ship over 1.5 billion units per annum within 4 years.
"Our first SmartBond device, the DA14580, propelled Dialog rapidly into
market leadership, thanks to its unique combination of exceptionally small
size and minimal power consumption. We've been particularly successfully in
human interface devices (HID), proximity sensing, medical devices, and
smart home applications. The new SoCs will accelerate our market share
growth as we help customers in other fast-growing consumer markets achieve
their design goals rapidly and reliably," said Sean McGrath, Senior Vice
President and General Manager, Connectivity, Automotive & Industrial
Business Group at Dialog Semiconductor.
"In the wireless charging and RCU markets, Bluetooth low energy is the
ideal protocol for control and communications because it's ubiquitous in
smartphones, tablets, smart televisions and a host of other consumer
devices. As we extend our SmartBond product family, we will continue to
make it easier for customers to integrate these ultra-low power, fully
hosted Bluetooth solutions so that they can offer consumers unrivalled
battery life with their products," he added.
The DA14581 is optimised for loosely coupled, highly resonant inductive
charging based on the A4WP standard. In order to guarantee charging in all
conditions, even when the battery is dead, the DA14581 is capable of
booting up in under 50 ms when used in the Power Receiving Unit. When used
in the Power Transmitting Unit, the optimized device can track and control
the charging of 8 devices simultaneously. Optimised code for HCI, which
provides standardised communication between the host stack and controller,
can now be programmed into One-Time-Programmable (OTP) memory enabling
users to create pre-programmed HCI products to be used with external
microcontrollers and third-party stacks. Market analyst Darnell says that
by 2020 sales of wireless charging receiver and transmitter chips will
reach $2.8 billion.
Integrating an analogue audio codec with native support for microphones,
the DA14582 is optimised for RCUs that use voice recognition, motion and
gesture recognition to control next-generation Smart TVs and set-top boxes.
As set-top boxes and smart televisions begin to have built-in Wi-Fi and
Bluetooth Smart functionality, Bluetooth Smart is replacing Bluetooth
Classic in remote controls due to lower power consumption and reduced
connection latency.
The third new device, the DA14583, is a SmartBond SoC with 1 Mbit (128
kByte) of flash. This memory variant of the DA14580 enables customers to
keep their deployed products up-to-date through software upgrades Over The
Air (OTA). The part is pin-compatible with the DA14580 OTP version. This
provides designers with a cost reduction path from flash to OTP once they
have matured their application software, particularly if they need OTA
upgrades during the initial phase of development and production.
SmartBond SoCs integrate a Bluetooth low energy radio with an ARM(R)
Cortex(TM)-M0 application processor and intelligent power management.
Needing only five external components for a complete standalone Bluetooth
Smart solution, the devices offer an unmatched level of system integration
combined with the world's lowest power consumption. The device's ARM Cortex
M0 processor and full set of digital and analogue peripherals are
accessible via up to 32 GPIOs, which is ideal for all Bluetooth Smart
applications. Since the introduction the DA14580 in January 2014 with the
best power performance on the market, Dialog has achieved a further 20%
reduction in power consumption for all devices in the family.
SmartBond development kits come with a power profiler, to enable
power-optimised coding, and Dialog's SmartSnippets(TM) software development
environment, which is based on Keil(TM)'s µVision tools. The kits include
example application code for both embedded and hosted modes to accelerate
product development.
- ENDS -
Company Contact:
Lauren Ofstedahl
Dialog Semiconductor
Phone: +1 (408) 845 8518
lauren.ofstedahl@diasemi.com
Web: www.dialog-semiconductor.com
Twitter: @DialogSemi
Media Contact:
Bob Jones
Publitek
Phone: +44 (0)1225 470000
bob.jones@publitek.com
Web: www.publitek.com
About Dialog Semiconductor
Dialog Semiconductor provides highly integrated standard (ASSP) and custom
(ASIC) mixed-signal integrated circuits (ICs), optimised for Smartphone,
Tablet, IoT, Solid State Lighting (SSL) and Smart Home applications. Dialog
brings decades of experience to the rapid development of ICs while
providing flexible and dynamic support, world-class innovation and the
assurance of dealing with an established business partner. With world-class
manufacturing partners, Dialog operates a fabless business model and is a
socially responsible employer pursuing many programs to benefit the
employees, community, other stakeholders and the environment we operate in.
Dialog's power saving technologies including DC-DC configurable system
power management deliver high efficiency and enhance the consumer's user
experience by extending battery lifetime and enabling faster charging of
their portable devices. Its technology portfolio also includes audio,
Bluetooth(R) Smart, Rapid Charge(TM) AC/DC power conversion and
multi-touch.
Dialog Semiconductor plc is headquartered in London with a global sales,
R&D and marketing organisation. In 2014, it had approximately $1.16 billion
in revenue and was one of the fastest growing European public semiconductor
companies. It currently has approximately 1,400 employees worldwide. The
company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated
Market, Prime Standard, ISIN GB0059822006) and is a member of the German
TecDax index. It also has convertible bonds listed on the Euro MTF Market
on the Luxemburg Stock Exchange (ISIN XS0757015606).
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Language: English
Company: Dialog Semiconductor Plc.
Tower Bridge House, St. Katharine's Way
E1W 1AA London
United Kingdom
Phone: +49 7021 805-412
Fax: +49 7021 805-200
E-mail: jose.cano@diasemi.com
Internet: www.diasemi.com
ISIN: GB0059822006, XS0757015606
WKN: 927200
Indices: TecDAX
Listed: Regulated Market in Frankfurt (Prime Standard); Regulated
Unofficial Market in Berlin, Dusseldorf, Hamburg, Munich,
Stuttgart
End of News DGAP News-Service
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336365 24.03.2015
DGAP-News: Dialog Semiconductor Plc.: Dialog Semiconductor Expands Bluetooth(R) Smart SoC Family with Application-Optimised Versions
| Source: EQS Group AG