BOSCH Sensortec's BMF055: Technology and Cost Comparison with Cost & Price Comparison with InvenSense ICM-30630 6-Axis Sensor Hub

Dublin, May 18, 2016 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of the "BOSCH Sensortec BMF055: Technology and Cost Comparison" report to their offering.

Like its competitor InvenSense, BOSCH Sensortec has unveiled a programmable all-in-one motion sensor for robotics, gaming, and household IoT devices, touted as the industry's first custom-programmable 9-axis motion sensor.

The BMF055 is a new version of the BOSCH Sensortec 9-axis device (3-axis Gyroscope + 3-axis Accelerometer + 3-axis Magnetometer), with a MCU included in the package. Compared to the stand-alone sensor hub, this new approach eliminates a package and reduces system-level power. This device integrates six-chip in a complex System-in-Package.

The sensor hub combines a 14-bit accelerometer, a 16-bit gyroscope, and a geomagnetic sensor with a 32-bit ARM Cortex M0+ core. Compared to rivals, BOSCH Sensortec targets a broader range of customer applications with a high precision-sensor and dedicated MCU.

With BOSCH Sensortec's approach, the MEMS sensor and the ASIC are fabricated separately. Final assembly entails wire bonding of all parts . The BMF055 is shipped in a 5.8×3.2×1.15mm LGA package, a footprint that's larger than the competition.

This report features a detailed technology and cost comparison with the leading-edge sensor hub from InvenSense, highlighting the different choices from the two different designers.

Key Topics Covered:

Overview / Introduction

Bosch Company Profile

Physical analysis

- Package
-- Package characteristics: view, dimensions, and opening
-- Package cross-section

- ASIC Dies
-- View, dimensions, and markings
-- Delayering and main blocks ID
-- Cross-section
-- Process characteristics

- MEMS Dies
-- View, dimensions, and markings
-- Bond pad opening and bond pad
-- MEMS cap removed and details
-- Sensing area details
-- MEMS cross-section
-- MEMS process characteristics

- MCU Die
-- View, dimensions, and markings
-- Delayering and main blocks ID
-- Process and die cross-section
-- Die process characteristics

- Magnetometer Die
-- View, dimensions, and markings
-- Hall sensor and fluxgate sensor
-- Delayering and main blocks ID
-- Process and die cross-section
-- Die process characteristics

Manufacturing Process Flow

- Global overview
- ASIC front-end process
- MEMS process flow
- Magnetometer process flow
- ASIC, MEMS, and MCU wafer fabrication unit
- Packaging process flow and assembly unit

Cost Analysis

- Main steps of economic analysis
- Yields hypotheses
- ASIC & MCU front-end cost
- ASIC & MCU back-end 0: probe test and dicing
- ASIC & MCU wafer & die cost
- MEMS front-end cost
- MEMS front-end cost per process steps
- MEMS back-end 0: probe test and dicing
- MEMS wafer and die cost
- Magnetometer CMOS front-end cost
- Magnetometer sensor cost
- Magnetometer sensor cost per process steps
- Magnetometer back-end 0: probe test and dicing
- Magnetometer wafer and die cost
- Back-end: packaging cost
- Back-end: packaging cost per process steps
- Back-end: final test cost
- Component cost and price

Cost & price comparison with InvenSense ICM-30630 6-Axis Sensor Hub

For more information visit http://www.researchandmarkets.com/research/fkrv7w/bosch_sensortec