FREMONT, Calif., Sept. 01, 2016 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it has begun production shipments to its initial lead customer for its FOX-1P single wafer test system and has shipped and received acceptance on the first production systems previously ordered by this customer. This follows the company’s announcement in July of the shipment of the initial FOX-1P system to this customer. The FOX-1P system is Aehr Test’s next generation single wafer test system for high volume production and early failure rate (EFR) test. Aehr Test expects to complete shipment of the remaining systems in backlog to the customer’s production site within its fiscal second quarter ending November 30, 2016.
Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are very pleased to begin shipment of production FOX-1P systems to this lead customer. In addition, we are pleased that this customer has expanded test applications for this system to include microcontrollers in addition to the initial target of non-volatile memories.”
The FOX-1P wafer test system is a member of Aehr Test’s next generation FOX-P family of wafer level test and burn-in systems and has more than 16,000 “Universal Channels” (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). With the highest channel count available in the ATE industry, the flexibility of Aehr Test’s Universal Channel architecture, and the ability to perform both functional pattern verification and parametric testing at full-wafer parallel test, the FOX-1P system provides a highly differentiated solution from competitive alternatives for microcontroller test, flash wafer test, embedded memory or any wafer with long test times. These capabilities are particularly well suited for automotive applications where test and burn-in for early failure screening of devices is vital.
The FOX-1P is integrated with a high performance dual wafer probing platform developed by Semics, Inc. that incorporates two FOX-1P test systems in an industry leading small footprint for a high performance full featured wafer prober.
The FOX-P product family also includes multi-wafer FOX-XP test solutions that utilize the same Universal Channel technology. The FOX-XP systems are capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, optical devices, laser diodes, VCSELs, LEDs and other leading edge ICs in wafer form before they are assembled into multi-die stacked packages or other applications where known good die are critical. These end applications can span enterprise solid state drives, automotive devices, highly valuable mobile applications, communications and mission critical integrated circuits and sensors.
The multi-wafer FOX-XP system utilizes the FOX-1P Channel Module to provide up to 2,048 Universal Channels per wafer, allowing the system to test all the devices on each wafer in parallel. This enhanced architecture allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing. The multi-wafer FOX-XP system utilizes Aehr Test's FOX WaferPak contactor, which provides a cost effective solution for making electrical contact with a full wafer or substrate in a multi-wafer environment which can be scaled to simultaneously test up to 54 wafers in a single test cell.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and wafer level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX families of test and burn-in systems and WaferPak contactors. The ABTS systems are used in production and qualification testing of packaged parts for both low-power and high-power logic as well as memory devices. The FOX family of systems includes single and multi-wafer full wafer contact test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. For more information, please visit Aehr Test’s website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements based on current expectations, forecasts and assumptions that involve risks and uncertainties. These statements are based on information available to Aehr Test as of the date hereof and actual results could differ materially from those stated or implied due to risks and uncertainties. Forward-looking statements include statements regarding Aehr Test's expectations, beliefs, intentions or strategies regarding the FOX products, including statements regarding future market opportunities and conditions, expected product shipment dates and customer orders or commitments. These risks and uncertainties include, without limitation, acceptance by customers of the FOX-1P system and the ability of new products to meet customer needs or perform as described, as well as general market conditions, customer demand and acceptance of Aehr Test’s products and Aehr Test’s ability to execute on its business strategy. See Aehr Test’s recent 10-K, 10-Q and other reports from time to time filed with the Securities and Exchange Commission for a more detailed description of the risks facing Aehr Test’s business. Aehr Test disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.