New Platform to Accelerate Development of Premium, Flagship Mobile Devices, Providing Innovative Architectures for Artificial Intelligence and Immersive Experiences
VANCOUVER, British Columbia, April 16, 2019 (GLOBE NEWSWIRE) -- Intrinsyc Technologies Corporation (TSX: ITC and OTC: ISYRF) (“Intrinsyc”), a leading developer of intelligent connected devices, today announced the availability of the Snapdragon™ 855 Mobile Hardware Development Kit, a new mobile hardware development kit (HDK) featuring the Qualcomm® Snapdragon™ 855 Mobile Platform, a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.
To support the ecosystem of technology companies and application providers looking to utilize the advanced features of the Snapdragon 855, Intrinsyc Technologies Corporation is introducing the Snapdragon™ 855 Mobile Hardware Development Kit. The HDK is an open-frame solution that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, as well as provide original equipment manufacturers (“OEMs”), developers and engineers with next generation software technology and tools to accelerate development and testing of devices. It includes all the software tools and accessories required to immediately begin development work. The HDK is a full featured Android development platform that provides an ideal starting point for creating high-performance mobile devices and applications.
“The Qualcomm® Snapdragon™ 855 Mobile Platform pushes the boundaries of computing and power performance; with innovations in immersive multimedia, artificial intelligence, and security,” said Victor Gonzalez, Vice President, Engineering, Intrinsyc. “We are very excited to offer access to a comprehensive development kit allowing technology companies and connected device makers to accelerate their product development using the powerful and innovative Snapdragon 855 Mobile Platform.”
The Snapdragon 855 utilizes Qualcomm Technologies’ heterogenous compute expertise to offer a platform for immersive multimedia experiences including eXtended reality (XR), on-device artificial intelligence (AI), lightning-fast connectivity, and a secure processing unit (SPU) engineered to support vault-like security for premium, flagship mobile devices.
Supporting a robust mobile performance, the Snapdragon 855 includes the following features:
- Qualcomm® Kryo™ 485 CPU
- Continuous 4K HDR capture
- Qualcomm® Hexagon™ 690 DSP featuring 2x Vector eXtensions and a new Tensor accelerator
- Qualcomm® Adreno™ 640 GPU
- Qualcomm® aptX™ Adaptive and Qualcomm Aqstic™ audio technology
- Qualcomm® Artificial Intelligence (AI) Engine
- Qualcomm® Wi-Fi 6-ready
The HDK is an ideal platform for development in artificial intelligence, app development, IP cameras and smart phones. Connectors, ports and accessories available with Snapdragon™ 855 Mobile Hardware Development Kit:
- Connectivity:
- Wi-Fi 802.11ac 2x2 with MU-MIMO
- Bluetooth 5.0
- GNSS (GPS/GLONASS/COMPASS/GALILEO)
- I/O Interfaces:
- 1x USB 3.1 Type C +2x USB 3.0 Type A
- DisplayPort over USB 3.1 Type-C
- 1x Micro SD Card
- 2x MIPI 4-lane DSI + touch panel
- 4x MIPI 4-lane CSI with support for 3D camera configuration
- 1x HDMI out
- Expansion headers for additional features
- Sensor I/O
- Headset
- Audio Input/Output
- Operating System: Android 9
- Optional Accessories:
- Display + Expansion Board: TFT QHD LCD (2560x1440) with Touch Panel, 5.7”
- Cameras: 12MP + 5MP Front, DUAL 12MP + 13MP Rear
Users of Intrinsyc Snapdragon™ 855 Mobile Hardware Development Kit will receive product documentation and access to complimentary tools and software updates, and additional technical support or product development assistance through Intrinsyc’s technical support services. Intrinsyc’s expertise includes device driver development as well as advanced proficiency in camera development and tuning, audio tuning, and artificial intelligence.
The Snapdragon™ 855 Mobile Hardware Development Kit is available to order at https://shop.intrinsyc.com/collections/product-development-kits/products/snapdragon-855-hdk
About Intrinsyc Technologies Corporation
Intrinsyc provides comprehensive product development services, as well as the industry’s highest-performance production-ready computing modules, to enable rapid commercialization of embedded and Internet of Things (“IoT”) products. Intrinsyc has successfully delivered over 1,300 client projects including sophisticated consumer and industrial IoT products like: robotics, connected cameras, smart displays, augmented reality, smart buildings, wearables, in-vehicle infotainment, and many others. Intrinsyc’s Open-Q™ System on Modules incorporate the industry’s most advanced Qualcomm® Snapdragon™ processor technology from Qualcomm Technologies, Inc., and help OEMs to rapidly bring industry leading products, with rich functionality and high performance, to market. Intrinsyc is publicly traded (TSX: ITC and OTCQX: ISYRF) and is headquartered in Vancouver, BC, Canada; with additional product development centers in Taipei, Taiwan, and Bangalore, India.
For more information, please contact:
Victor Gonzalez
Vice President, Engineering
Intrinsyc Technologies Corporation
Email: vgonzalez@intrinsyc.com
Phone: +1-604-801-6461
Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.
Qualcomm, Snapdragon, Kryo, Adreno, and Hexagonare trademarks of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Aqstic is a trademark of Qualcomm Incorporated. aptX is a trademark of Qualcomm Technologies International, Ltd., registered in the United States and other countries.
Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm aptX, Qualcomm Aqstic, Qualcomm Wi-Fi 6, and Qualcomm Artificial Intelligence Engine are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Other products or brand names may be trademarks or registered trademarks of their respective owners.
A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/5b5bb3f9-be24-4797-821a-8636839e43be