Dublin, July 06, 2020 (GLOBE NEWSWIRE) -- The "Nokia 5G AirScale BBU" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.
This report provides a comprehensive analysis of the Nokia Networks 5G AirScale Digital Baseband Unit (BBU). The configuration of the 5G AirScale is:
- AMIA Subrack
- ASIK Common Plug In Unit
- ABIL Capacity Plug In Unit
Features
- System Functional Description
- System Level Block Diagrams
- High Level Mechanical Analysis
- Heat Sink
- High Level PCB Analysis
- Component Diagrams
- Semiconductor/component locations on PCB
- High Level Bill of Materials
- Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
- Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
- Complete Part Number/Marking
- Component Manufacturer Identification
- Function Component Description
- Package Type
Key Topics Covered
EXECUTIVE SUMMARY
- Active/Passive Component Summary
- Important Note
CHAPTER 1: NOKIA AIRSCALE SYSTEM MODULE
- Overview of AirScale BTS Portfolio
CHAPTER 2: AMIA SUBRACK
- AMIA Guiderails
- ASIx Blind Slot Frame
- ABIx Blind Slot Frame
- AMIA Chassis: External Views and Dimensions
- AMIA Chassis: Backplane and Fan Units
- AMIA Backplane
CHAPTER 3: ASIK PLUG IN UNIT
- ASIK Front Panel & Handles
- Power Supply Unit (PSU)
- PSU Top Cover Heatsink
- PSU Bottom FCTL Heatsink
- PSU Printed Circuit Board Analysis
- PSU Input DC Voltage Connector Assembly
- PSU DC Busbar Assembly
- ASIK FCTL PCB
- eUSB Flash Card
- OCXO Module
- ASIK FCTL Bottom Cover
CHAPTER 4: ABIL
- ABIL Front Panel
- ABIL ASPA Heatsink
- ABIL ASPA Cover
- ABIL ASPA PCB
For more information about this report visit https://www.researchandmarkets.com/r/zcdcz0
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