Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
19 mars 2024 08h02 HE
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Deca Technologies
Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.
Deca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium
18 oct. 2022 10h00 HE
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Deca Technologies
TEMPE, Ariz., Oct. 18, 2022 (GLOBE NEWSWIRE) -- Deca Technologies, a leading provider of advanced electronic interconnect technology, is proud to announce that its founder and CEO, Tim Olson, was...
Deca collaborates with ASE and Siemens to launch APDK™ design methodology
18 mars 2021 09h00 HE
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Deca Technologies
TEMPE, Ariz., March 18, 2021 (GLOBE NEWSWIRE) -- Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive...
Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling
20 oct. 2020 09h00 HE
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Deca Technologies
TEMPE, Ariz., Oct. 20, 2020 (GLOBE NEWSWIRE) -- Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC...
nepes Corporation to Acquire Deca Technologies Manufacturing Operations
01 oct. 2019 16h18 HE
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Deca Technologies
TEMPE, Ariz., Oct. 01, 2019 (GLOBE NEWSWIRE) -- Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic...
Advanced Fan-out Technology Breakthrough: Deca Technologies’ M-Series™ Identified in Samsung S10, Xiaomi Mi 9 and LG G8 Handsets
14 août 2019 23h43 HE
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Deca Technologies
TEMPE, Ariz., Aug. 14, 2019 (GLOBE NEWSWIRE) -- Deca Technologies, a wafer-level electronic interconnect solutions provider to the semiconductor industry, today announced that Industry researchers...