SCANFIL PLC 3 APRIL 2008 3.50 P.M.
SCANFIL PLC'S ANNUAL GENERAL MEETING, 3 APRIL 2008
Scanfil plc's Annual General Meeting has in it's meeting on 3 April 2008
confirmed the Financial Statements for 2007 and discharged the Board of
Directors and the President from liability.
According to Board of Directors' proposal The Annual General Meeting decided to
distribute a dividend of EUR 0.12 per share, or a total of EUR 7,045,898.52. The
record date for the payment of dividend is 8 April 2008 and the date of payment
of the dividend is 15 April 2008.
The Meeting resolved that the Board of Directors consists of five members.
Asa-Matti Lyytinen, Jorma J. Takanen, Reijo Pöllä, Jarkko Takanen and Tuomo
Lähdesmäki were re-elected as members of the Board of Directors. In it's
meeting, held after the General Meeting, the Board of Directors elected Jorma J.
Takanen as the Chairman of the Board of Directors and Asa-Matti Lyytinen as Vice
Chairman of the Board of Directors.
The Meeting decided according to the Board of Directors' proposal to authorize
the Board of Directors to decide on the acquisition of the Company's own shares
with distributable assets.
The Meeting approved the Board of Directors' proposal to split up the company
with a business transfer to an investment company Scanfil plc and sub-concern
Scanfil EMS Oy practicing contract manufacturing business. The meeting
authorised the Board to decide on all required measures to execute and implement
the business transfer.
The Meeting approved the Board of Directors' proposal to amend the Articles of
Association.
SCANFIL PLC
Harri Takanen
President
Additional information
President Harri Takanen, tel +358 8 4882 111
DISTIBUTION Helsinki Exchanges
Major Media
www.scanfil.com
Scanfil plc is a global contract manufacturer and systems supplier for
communication and industrial electronics with over 30 years experience in
demanding contract manufacturing
Scanfil offers contract-manufacturing services as a systems supplier to the
telecommunication industry, mainly to wireless communication sector, as well as
to the industrial electronics industry. Main telecommunication products are
among others integrated enclosure systems for mobile phone and ADSL networks and
assembly and testing of modules related to enclosure systems. Examples of
industrial electronics products include box-built tested devices, various
electronic modules, backplanes and assembled circuit boards as well as cable
assemblies. Production plants are situated in China, Hungary, Estonia and
Finland.