Inphi Management Holds Virtual Fireside Chat with Stifel Financial Corp.
March 27, 2020 08:00 ET
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Inphi Corporation
SANTA CLARA, Calif., March 27, 2020 (GLOBE NEWSWIRE) -- Inphi Corporation (NYSE: IPHI), a leader in high-speed data movement interconnects, participated in a virtual fireside chat on March 26, 2020...
Inphi Corporation Delivers Record Revenue and Earnings in Q4 2019
February 04, 2020 16:05 ET
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Inphi Corporation
SANTA CLARA, Calif., Feb. 04, 2020 (GLOBE NEWSWIRE) -- Inphi Corporation (NYSE: IPHI), a leader in high-speed data movement interconnects, today announced financial results for its fourth quarter...
Inphi Completes Acquisition of eSilicon
January 13, 2020 09:00 ET
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Inphi Corporation
SANTA CLARA, Calif., Jan. 13, 2020 (GLOBE NEWSWIRE) -- Inphi Corporation (NYSE: IPHI), a leader in high-speed data movement interconnects, today announced that it has completed the acquisition of...
SC19: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Five-Meter Samtec Cable Assembly
November 14, 2019 08:00 ET
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eSilicon Corporation
SAN JOSE, Calif., Nov. 14, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, and Samtec, a leading...
eSilicon to be Acquired by Inphi and Synopsys
November 11, 2019 08:33 ET
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eSilicon Corporation
SAN JOSE, Calif., Nov. 11, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of a...
Inphi to Acquire eSilicon, a Leading Provider of 2.5D Packaging, SerDes and Custom Silicon
November 11, 2019 08:00 ET
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Inphi Corporation
SANTA CLARA, Calif., Nov. 11, 2019 (GLOBE NEWSWIRE) -- Inphi Corporation (NYSE: IPHI), a leading provider of high-speed data movement interconnects, today announced that it has signed a definitive...
eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
September 22, 2019 00:00 ET
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eSilicon Corporation
SAN JOSE, Calif., Sept. 22, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today its 7nm...
CORRECTING and REPLACING -- eSilicon Corporation
September 19, 2019 13:38 ET
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eSilicon Corporation
SAN JOSE, Calif., Sept. 19, 2019 (GLOBE NEWSWIRE) -- In a release issued under the same headline today by eSilicon Corporation, please note that in the headline of the release, it should be...
ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies
September 19, 2019 08:00 ET
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eSilicon Corporation
SAN JOSE, Calif., Sept. 19, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, and Samtec, a leading...
AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable
September 12, 2019 16:34 ET
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eSilicon Corporation
SAN JOSE, Calif., Sept. 12, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will partner with Samtec,...