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eSilicon Announces Technical Advisory Board
January 29, 2019 08:00 ET | eSilicon Corporation
SAN JOSE, Calif., Jan. 29, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the formation of...
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DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly
January 23, 2019 08:00 ET | eSilicon Corporation
SAN JOSE, Calif., Jan. 23, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will team up with Samtec...
Sunflower Mission awards 59 university scholarships to Vietnam’s future engineers
December 20, 2018 17:00 ET | eSilicon Corporation; Sunflower Mission
HO CHI MINH CITY, Vietnam, Dec. 20, 2018 (GLOBE NEWSWIRE) -- Sunflower Mission marked its sixteenth year of supporting student education in Vietnam and presented a total of 59 university...
Tổ chức Sunflower Mission trao 59 suất học bổng cho các kỹ sư tương lai của Việt Nam
December 20, 2018 17:00 ET | eSilicon Corporation; Sunflower Mission
Thành phố Hồ Chí Minh, Việt Nam, Dec. 21, 2018 (GLOBE NEWSWIRE) -- Ngày 20 tháng 12, 2018 –  Tổ chức Sunflower Mission đã đánh dấu 16 năm hỗ trợ giáo dục tại Việt Nam và trao tặng 59 suất...
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SemIsrael 2018: eSilicon to present on IP platforms for AI and high-performance networking ASICs
November 20, 2018 00:00 ET | eSilicon Corporation
SAN JOSE, Calif., Nov. 20, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will present its two new...
eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing
October 25, 2018 08:00 ET | eSilicon Corporation
Demos and private meetings available at SC18 SAN JOSE, Calif., Oct. 25, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D...
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ITC 2018: eSilicon to present on DFT for deep learning ICs and DFT for large 2.5D/3D devices October 30-31, 2018
October 24, 2018 08:00 ET | eSilicon Corporation
SAN JOSE, Calif., Oct. 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will deliver two...
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eSilicon to demonstrate silicon performance of its 7nm 56G long-reach SerDes at ECOC, September 24-26, 2018
September 20, 2018 08:00 ET | eSilicon Corporation
SAN JOSE, Calif., Sept. 20, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate the...
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eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design
September 18, 2018 05:00 ET | eSilicon Corporation
SAN JOSE, Calif., Sept. 18, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the...
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eSilicon to present power optimization paper at SNUG Singapore, September 21, 2018
September 17, 2018 19:02 ET | eSilicon Corporation
SAN JOSE, Calif., Sept. 17, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will present Power...