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SAN JOSE, Calif., July 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASIC design, market-specific IP platforms and advanced 2.5D packaging solutions, will present...
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BUCHAREST, Romania, July 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today at...
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7nm networking platform delivers unprecedented performance and configurability for data center ASICs
SAN JOSE, Calif., June 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the...
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Presentations Tuesday, June 26 at Chip Estimate Booth 2:00-2:15 PM; Samsung Theatre 3:00-3:15 PM; Mentor Booth 4:00 – 5:00 PM Join us at Stars of IP Party for appetizers, hosted bar, prizes and fun ...
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SANTA CLARA, Calif., June 05, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced 2.5D packaging solutions, announced today at the Machine...
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Chip employs TSMC CoWoS® technology to integrate SoC and HBM2 SAN JOSE, Calif., May 01, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced...
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SAN JOSE, California, Hoa Kỳ và thành phố Hồ Chí Minh, Việt Nam, April 05, 2018 (GLOBE NEWSWIRE) -- eSilicon, nhà cung cấp thiết kế chip ASICs, lõi IP và các giải pháp đóng gói 2.5D...
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SAN JOSE, Calif. and HO CHI MINH CITY, Vietnam, April 04, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, has...
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03 avr. 2018 08h30 HE | Source: eSilicon; Samsung Electronics Co., Ltd.; Amkor Technology, Inc.; Northwest Logic
SAN JOSE, Calif., April 03, 2018 (GLOBE NEWSWIRE) -- Deep learning applications require extreme performance, low power and high efficiency to effectively process the massive amounts of data used in...
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SAN JOSE, Calif., March 27, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, will present Enabling Technology for...