Pune, Oct. 24, 2023 (GLOBE NEWSWIRE) --
The SIC Wafer Polishing Market, as per the SNS Insider report, was valued at USD 0.36 billion in 2022. It is anticipated to reach USD 4.57 billion by 2030, exhibiting a remarkable compound annual growth rate (CAGR) of 37.4% during the forecast period from 2023 to 2030.
Market Overview
SIC wafer polishing is a specialized manufacturing process designed to refine the surface of Silicon Carbide wafers, ensuring they meet the stringent requirements of modern electronics and power devices. Silicon Carbide, with its superior thermal conductivity, high breakdown voltage, and excellent mechanical strength, has become a material of choice for high-power and high-frequency applications. SiC wafers are instrumental in RF applications like high-power amplifiers and communication systems. The polished wafers enable the development of high-frequency devices with reduced signal losses and improved heat dissipation. Polished SiC wafers serve in the manufacturing of optoelectronic devices, including UV photodetectors and high-power LEDs (Light-Emitting Diodes). The smooth surface enhances light emission efficiency and sensitivity, crucial for optoelectronic performance.
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Market Analysis
The global shift towards sustainable transportation solutions has led to the proliferation of electric vehicles (EVs). SiC wafers play a pivotal role in enhancing the efficiency of EV powertrains. The inherent properties of SiC, including high breakdown voltage and superior thermal conductivity, make it indispensable for manufacturing high-performance EV components. As the EV market continues to expand, the demand for polished SiC wafers for EV applications is set to soar, bolstering the growth of the SiC wafer polishing market. The renewable energy sector, encompassing solar and wind energy, relies on advanced power electronics to harness and distribute energy efficiently. SiC-based devices are highly efficient in converting and managing power in renewable energy systems. With the global emphasis on transitioning towards renewable energy sources, the demand for SiC wafers used in solar inverters and wind power systems is witnessing a substantial surge. This surge, in turn, is fuelling the growth of the market. Technological advancements in wafer polishing techniques have significantly enhanced the efficiency and precision of SiC wafer polishing processes. Innovations such as chemical mechanical polishing (CMP) and advanced abrasive materials have revolutionized the manufacturing of polished SiC wafers.
SIC Wafer Polishing Market Overview & Scope:
| Report Attributes | Details |
| Market Size in 2022 | USD 0.36 billion |
| Market Size by 2030 | USD 4.57 billion |
| CAGR | CAGR of 37.4% over 2023-2030 |
| Key Segments | By Process Type (Mechanical polishing, Chemical-mechanical polishing, Electropolishing, Chemical polishing, Plasma-assisted polishing, Others) By Product Type (Abrasive powders, Polishing pads, Diamond slurries, Colloidal silica suspensions, Others) By Application (Power Electronics, Light-emitting diodes, Sensors and detectors, RF and microwave devices, Others) |
| Key Market Players | Kemet International, Entegris, Iljin Diamond, Fujimi Corporation, Saint-Gobain, JSR Corporation, Engis Corporation, Ferro Corporation, 3M , SKC, DuPont Incorporated, Fujifilm Holding America Corporation and other players |
| Pricing & Purchase Options | Avail customized purchase options to meet your exact research needs. Explore purchase options. |
Key Takeaway from SIC Wafer Polishing Market Study
- The market is witnessing significant shifts, with the power electronics segment emerging as a dominant force. SiC wafers are vital components in power electronics applications due to their exceptional properties, including high thermal conductivity and superior electrical characteristics. These properties make them ideal for high-power and high-temperature applications, driving the demand in power electronics.
- The abrasive powders segment stands as a cornerstone of the SIC wafer polishing market. The meticulous process of SiC wafer polishing requires abrasive powders with specific characteristics, such as particle size and hardness, to achieve the desired surface finish and flatness. Manufacturers in this segment play a pivotal role in supplying high-quality abrasive powders tailored for SiC wafer polishing applications.
Recent Developments
- DISCO Corporation, a pioneering name in the semiconductor and electronic components industry, has recently disclosed its latest venture – the Haneda Research and Development Center situated in the heart of Higashikojiya, Ota-ku, Tokyo. Equipped with state-of-the-art facilities and cutting-edge technologies, this center is meticulously designed to foster creativity and collaboration among some of the brightest minds in the field.
- Revasum, Inc. and Saint-Gobain Surface Solutions (SGSS) have joined forces to revolutionize the field of silicon carbide wafer grinding. The collaboration aims to enhance the efficiency and precision of silicon carbide wafer production, addressing the growing demand for advanced semiconductor materials.
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Market Dynamics Analysis
In the the SIC wafer polishing market, several key dynamics shape the industry's trajectory. Driving this market forward are factors like the growing demand for high-performance electronic devices and the escalating need for efficient power management solutions, particularly in automotive and aerospace sectors. Additionally, advancements in SIC wafer polishing technologies and materials are propelling market growth, fostering innovation in various industries. Despite these driving forces, the market faces its fair share of challenges. Stringent regulations and environmental concerns related to chemical usage in the polishing process pose significant restraints, compelling industry players to invest in eco-friendly solutions and sustainable practices. Furthermore, the scarcity of skilled technicians and the high initial setup costs present notable challenges, hindering the market's widespread adoption. Moreover, there are threats emanating from intense market competition, leading companies to focus on continuous research and development, strategic collaborations, and mergers to maintain their competitive edge. Navigating through these dynamics requires a comprehensive understanding of market trends and continuous adaptation to technological advancements, ensuring the SIC wafer polishing industry thrives amidst challenges, ultimately delivering cutting-edge solutions to meet evolving global demands.
Key Regional Developments
North America stands as a hub for technological innovations and semiconductor manufacturing. The region's SiC wafer polishing market is driven by the presence of key industry players, substantial research and development activities, and a growing demand for energy-efficient devices. Europe showcases a robust semiconductor industry, emphasizing the importance of SiC wafers in power electronics and automotive applications. With stringent environmental regulations encouraging the adoption of energy-efficient solutions, the demand for SiC wafer polishing in the region is on the rise. The Asia-Pacific region, led by countries like China, Japan, and South Korea, dominates the global semiconductor market. SiC wafers find extensive applications in consumer electronics, automotive, and industrial sectors in this region.
Impact of Recession
The SIC wafer polishing market, like many others, relies on complex global supply chains. The recession has disrupted these chains, causing delays in raw material procurement, manufacturing, and distribution. To counter the reduced demand, manufacturers might resort to price wars, offering products at lower prices to maintain market share. While this benefits consumers in the short term, it compresses profit margins for manufacturers. Striking a balance between competitive pricing and sustaining profitability becomes a daunting challenge amidst the recessionary pressures.
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Table of Contents:
1. Introduction
1.1 Market Definition
1.2 Scope
1.3 Research Assumptions
2. Research Methodology
3. Market Dynamics
3.1 Drivers
3.2 Restraints
3.3 Opportunities
3.4 Challenges
4. Impact Analysis
4.1 COVID-19 Impact Analysis
4.2 Impact of Ukraine- Russia war
4.3 Impact of ongoing Recession
4.3.1 Introduction
4.3.2 Impact on major economies
4.3.2.1 US
4.3.2.2 Canada
4.3.2.3 Germany
4.3.2.4 France
4.3.2.5 United Kingdom
4.3.2.6 China
4.3.2.7 Japan
4.3.2.8 South Korea
4.3.2.9 Rest of the World
5. Value chain Analysis
6. Porter’s 5 Forces Model
7. PEST Analysis
8. SIC Wafer Polishing Market Segmentation, By Process Type
8.1 Mechanical polishing
8.2 Chemical-mechanical polishing (CMP)
8.3 Electropolishing
8.4 Chemical polishing
8.5 Plasma-assisted polishing
8.6 Others
9. SIC Wafer Polishing Market Segmentation, By Product Type
9.1 Abrasive powders
9.2 Polishing pads
9.3 Diamond slurries
9.4 Colloidal silica suspensions
9.5 Others
10. SIC Wafer Polishing Market Segmentation, By Application
10.1 Power Electronics
10.2 Light-emitting diodes (LEDs)
10.3 Sensors and Detectors
10.4 RF and Microwave Devices
10.5 Others
11. Global SIC Wafer Polishing Market, by region/ country
11.1 Introduction
11.2 North America
11.2.1 USA
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 Eastern Europe
11.3.1.1 Poland
11.3.1.2 Romania
11.3.1.3 Turkey
11.3.1.4 Rest of Eastern Europe
11.3.2 Western Europe
11.3.2.1 Germany
11.3.2.2 France
11.3.2.3 UK
11.3.2.4 Italy
11.3.2.5 Spain
11.3.2.6 Netherlands
11.3.2.7 Switzerland
11.3.2.8 Austria
11.3.2.9 Rest of Western Europe
11.4 Asia-Pacific
11.4.1 China
11.4.2 India
11.4.3 Japan
11.4.4 South Korea
11.4.5 Vietnam
11.4.6 Singapore
11.4.7 Australia
11.4.8 Rest of Asia-Pacific
11.5 Middle East & Africa
11.5.1 Middle East
11.5.1.1 UAE
11.5.1.2 Egypt
11.5.1.3 Saudi Arabia
11.5.1.4 Qatar
11.5.1.5 Rest of Middle East
11.5.2 Africa
11.5.2.1 Nigeria
11.5.2.2 South Africa
11.5.2.3 Rest of Africa
11.6 Latin America
11.6.1 Brazil
11.6.2 Argentina
11.6.3 Colombia
11.6.4 Rest of Latin America
12. Company Profile
12.1 Kemet International (UK)
12.1.1 Company Overview
12.1.2 Financial
12.1.3 Products/ Services Offered
12.1.4 SWOT Analysis
12.1.5 The SNS View
12.2 Entegris (US)
12.3 Iljin Diamond (US)
12.4 Fujimi Corporation (Japan)
12.5 Saint-Gobain (US)
12.6 JSR Corporation (Japan)
12.7 Engis Corporation (US)
12.8 Ferro Corporation (US)
12.9 3M (US)
12.10 SKC (South Korea)
12.11 DuPont Incorporated (US)
12.12 Fujifilm Holding America Corporation (US)
13. Competitive Landscape
13.1 Competitive Bench marking
13.2 Market Share Analysis
13.3 Recent Developments
13.3.1 Industry News
13.3.2 Company News
13.3.3 Mergers & Acquisitions
14. Use Case and Best Practices
15. Conclusion
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