New York, United States , June 13, 2024 (GLOBE NEWSWIRE) -- The Global Wafer Cutting Fluids Market Size is to Grow from USD 1,788.9 Million in 2023 to USD 2,878.9 Million by 2033, at a Compound Annual Growth Rate (CAGR) of 4.87% during the projected period.
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Wafer-cutting fluids are liquids that are used in the semiconductor and solar industries. They are used to cut wafers, which are thin silicon sheets that are used to create solar cells and other electronic devices. Wafer-cutting fluids aid in the creation of clean cuts without causing damage to the wafer or the surrounding area. Furthermore, the fluid cleans and lubricates the surfaces of a wafer as it is cut. Wafer-cutting fluids are dynamic because they support certifying a clean, accurate cut while preventing wafer damage. The growing demand for solar panels is witnessed to be a significant driver of the wafer-cutting fluids market. The continuous growth in the demand for solar panels has resulted in an associated need for advanced and efficient wafer manufacturing processes that include wafer-cutting fluids. This surge in solar panel manufacture is primarily credited to various factors such as technological advancements, government grants, and the growing focus on renewable energy sources as a means of dropping environmental issues and endorsing sustainable practices. However, Advancements in substitute-cutting technologies create a potential challenge to the global wafer-cutting fluids market. The new alternative cutting technologies could hamper the market by offering more efficient and cost-effective solutions for wafer cutting. Moreover, growing focus on environmental sustainability, the products in the market offering less maintainable solutions or manufacturing processes associated therein could affect the market.
Browse key industry insights spread across 203 pages with 110 Market data tables and figures & charts from the report on the "Global Wafer Cutting Fluids Market Size, Share, and COVID-19 Impact Analysis, By Product Type (Water-Soluble, and Water-Insoluble), By Application (Semiconductor, Solar Wafer, and Others), and By Region (North America, Europe, Asia-Pacific, Latin America, Middle East, and Africa), Analysis and Forecast 2023 – 2033."
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The water-soluble segment is anticipated to hold the greatest share of the global wafer-cutting fluids market during the projected timeframe.
Based on the product type, the global wafer-cutting fluids market is divided into water-soluble, and water-insoluble. Among these, the water-soluble segment is anticipated to hold the greatest share of the global wafer-cutting fluids market during the projected timeframe. This is attributed to the ability of the product to easily dilute with water is practical to be the supreme driver for the dominance and high demand for water-soluble products.
The semiconductor segment is anticipated to hold the greatest share of the global wafer-cutting fluids market during the projected timeframe.
Based on the application, the global wafer-cutting fluids market is divided into semiconductors, solar wafers, and others. Among these, the semiconductor segment is anticipated to hold the greatest share of the global wafer-cutting fluids market during the projected timeframe. This is attributed to wafer-cutting fluids being a vital component of the semiconductor manufacturing process. Wafer-cutting fluids are used to lubricate the cutting tools and develop the quality of the wafer surfaces after cutting.
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Asia Pacific is expected to hold the largest share of the global wafer-cutting fluids market over the forecast period.
Asia Pacific is expected to hold the largest share of the global wafer-cutting fluids market over the forecast period. This is attributed to the swift development of end-use industries such as semiconductors, solar energy, and others. Furthermore, it is anticipated that increasing foreign investments and supportive government policies will propel manufacturing development in this region. Moreover, the presence of these producers in Taiwan and China along with the growing demand for semiconductors is observed to be the driving factor for the wafer-cutting fluid market. Asia Pacific region is one of the foremost solar wafer-cutting fluid producers, with China and India being the crucial consumers and providers of solar wafer-cutting fluid.
North America is predicted to grow at the fastest pace in the global wafer-cutting fluids market during the projected timeframe. This is attributed to the U.S. being the protruding country having the maximum established market. Increasing the end-user industry in North America is the main factor driving its growth. Furthermore, metalworking fluids can be utilized on ferrous metals and alloys such as cast iron, steel, and stainless steel, as well as non-ferrous metals and alloys such as aluminum, nickel, copper, and magnesium.
Competitive Analysis:
The report offers the appropriate analysis of the key organizations/companies involved within the global market along with a comparative evaluation primarily based on their product offering, business overviews, geographic presence, enterprise strategies, segment market share, and SWOT analysis. The report also provides an elaborative analysis focusing on the current news and developments of the companies, which includes product development, innovations, joint ventures, partnerships, mergers & acquisitions, strategic alliances, and others. This allows for the evaluation of the overall competition within the market. major vendors in the Global Wafer Cutting Fluids Market include Evonik Industries AG, Momentive, Exxon Mobil Corporation, Dynatex International, Keteca Singapore (Pte) Ltd., BASF SE, SINO-JAPAN CHEMICAL CO. LTD., UDM Systems, LLC, Valtech Corporation, Dow Chemical, Pace Technologies Corporation, SIC-Processing, Liaoning Oxiranchem, Liaoning Kelongchem, and others.
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Recent Developments
- In June 2023, Evonik Industries AG, the German chemicals producer, revealed cutting-edge dampening and defoaming solutions, enhancing wafer cutting despite manufacturing shifts to harder materials. Tego Surten E products deliver innovative cutting fluids for high-speed diamond and multi-wire sawing in PV wafer cutting. These solutions facilitate faster, better cutting with thinner wires and augmented draw speeds. Low-foaming formulas with ultra-low surface tension improve cut quality, speed, and dosing efficiency, producing higher-quality wafers.
Key Target Audience
- Market Players
- Investors
- End-users
- Government Authorities
- Consulting And Research Firm
- Venture capitalists
- Value-Added Resellers (VARs)
Market Segment
This study forecasts revenue at global, regional, and country levels from 2020 to 2033. Spherical Insights has segmented the Global Wafer Cutting Fluids Market based on the below-mentioned segments:
Global Wafer Cutting Fluids Market, By Product Type
- Water-Soluble
- Water-Insoluble
Global Wafer Cutting Fluids Market, By Application
- Semiconductor
- Solar Wafer
- Others
Global Wafer Cutting Fluids Market, Regional
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- Uk
- France
- Italy
- Spain
- Russia
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- Australia
- Rest of Asia Pacific
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- UAE
- Saudi Arabia
- Qatar
- South Africa
- Rest of the Middle East & Africa
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